Chapter 15: Quality Control of Assembly and Mounting

This chapter delineates detailed methods and tools for the visual inspection of soldered joints. It enumerates the primary types of defects and the capabilities of automatic visual and electrical inspection for their detection and highlights the use of automatic equipment for thermographic, acoustic...

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Bibliographic Details
Published in:Surface engineering and applied electrochemistry 2024, Vol.60 (3), p.572-598
Main Authors: Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.
Format: Article
Language:English
Subjects:
Automatic control
Base metal
Control equipment
Defects
Destructive testing
Electric contacts
Electrical resistance
Engineering
Load resistance
Machines
Manufacturing
Mechanical properties
Processes
Quality control
Soldered joints
Thermography
Vibration monitoring
Visual flight
X ray inspection
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Summary:This chapter delineates detailed methods and tools for the visual inspection of soldered joints. It enumerates the primary types of defects and the capabilities of automatic visual and electrical inspection for their detection and highlights the use of automatic equipment for thermographic, acoustic, and X-ray inspection of soldered and microsoldered joints. The methodology for monitoring transient electrical resistance in contact connections is also examined. For automatic electrical inspection of connections, systems equipped with flying probes are used. These systems supply power and receive signals from the inspected connection on the board or component, automatically verifying functionality. The criteria for assessing the strength of soldered joints include the magnitude of the pull-off force, the durability of the joints under alternating loads, and vibration resistance. Destructive testing is employed to ascertain the mechanical and physico-mechanical properties of soldered joints. In metallographic inspection, the diffusion zone between the solder and the base metal is identified, and the quality of the soldered joint is assessed based on its width. Typical defects of soldered joints and their causes are considered.
ISSN:1068-3755
1934-8002
DOI:10.3103/S1068375524700157