Enhanced Dielectric, Thermal, Energy Storage, Quality Factor, Impedance, and Conductivity Properties of Novel PVDF/PAN/ZrO2 Polymer Nanocomposites for Flexible Electronics Applications

ABSTRACT In this study, novel polymer nanocomposite films based on polyvinylidene fluoride/polyacrylonitrile/zirconium dioxide (PVDF/PAN/ZrO2) were prepared using a solution casting technique. The structural modifications and morphological properties were analyzed by x‐ray diffraction (XRD) and high...

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Bibliographic Details
Published in:Polymers for advanced technologies 2024-10, Vol.35 (10), p.n/a
Main Authors: Vilvanatha Prabu, A., Vijayaraghavan, G. V., Basheer Ahamed, M., Suganya, R.
Format: Article
Language:English
Subjects:
Dielectric loss
Dielectric properties
Electronics
Fillers
Flexible components
flexible energy storage
Impedance
Nanocomposites
PAN
Polyacrylonitrile
Polymer films
Polymers
Polyvinylidene fluorides
PVDF
Q‐factor
Thermal stability
Thermogravimetric analysis
Zirconium dioxide
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Summary:ABSTRACT In this study, novel polymer nanocomposite films based on polyvinylidene fluoride/polyacrylonitrile/zirconium dioxide (PVDF/PAN/ZrO2) were prepared using a solution casting technique. The structural modifications and morphological properties were analyzed by x‐ray diffraction (XRD) and high resolution scanning electron microscopy (HRSEM). The obtained results verified the filler‐polymer interactions and uniform dispersion of the ZrO2 filler in the host polymers (PVDF and PAN). Thermal stability of up to 46% leftover residue for 30% ZrO2 nano‐filler loading in the blend polymer nanocomposite was analyzed by thermogravimetric analysis (TGA). The dielectric properties such as dielectric constant and dielectric loss values and impedance, Q‐factor, and AC conductivity were analyzed using an impedance analyzer. The decrement in impedance with increasing nano‐filler content with improved dielectric, thermal, Q‐factor, energy density and conductivity properties signifies the prepared novel PVDF/PAN/ZrO2 polymer nanocomposite as an effective material for flexible electronics applications.
ISSN:1042-7147
1099-1581
DOI:10.1002/pat.6599