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Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification
To swiftly and precisely assess the IGBT’s thermal safety during the circuit design phase, this paper proposes a method of establishing an IGBT thermal network model by electrothermal coupling simulation and parameter identification. This model integrates electrothermal coupling simulation technique...
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Published in: | Journal of physics. Conference series 2024-12, Vol.2918 (1), p.12028 |
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description | To swiftly and precisely assess the IGBT’s thermal safety during the circuit design phase, this paper proposes a method of establishing an IGBT thermal network model by electrothermal coupling simulation and parameter identification. This model integrates electrothermal coupling simulation techniques and parameter identification methods. Firstly, the IGBT’s finite element model is established by COMSOL, aiming to acquire the temperature distribution patterns of the IGBT and its heat sink under various operating conditions. Then, the objective function of parameter identification is constructed. The IGBT thermal network model’s parameters are extracted by combining the electrothermal coupling simulation results with the primal-dual interior point method. Then the device’s junction-ambient thermal network model is obtained. The proposed method’s efficacy is validated through the comparison of the results and calculation time of the thermal network model and the electrothermal coupling simulation. |
doi_str_mv | 10.1088/1742-6596/2918/1/012028 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3145733316</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3145733316</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2048-9fc5044911549f5abe0177dcf68aa442ff09f72c845e83ce21149e248fab225e3</originalsourceid><addsrcrecordid>eNqFkNFKwzAUhosoOKfPYMA7YS5J0za91DHnZKDgvA5peuIy26YmLSK-vJnTiSCYmySc7_w_fFF0SvAFwZyPScboKE3ydExzEr5jTCimfC8a7Cb7uzfnh9GR92uM43CyQfQ-9Z0sKuNXNTQdqqFb2RJZjeazqyXqVuBqWaEGulfrnlFtS6hQIT0EpkFQgeqc_aaU7dvKNE_Im7qvZGcCIpsStdLJEAwOmTKUGG3U5_A4OtCy8nDydQ-jx-vpcnIzWtzN5pPLxUhRzPgo1yrBjOWEJCzXiSwAkywrlU65lIxRrXGuM6o4S4DHCighLAfKuJYFpQnEw-hsm9s6-9KD78Ta9q4JlSImLMmCCZIGKttSylnvHWjROlNL9yYIFhvTYuNQbHyKjWlBxNZ02Dzfbhrb_kTf3k8efoOiLXWA4z_g_yo-APifj70</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3145733316</pqid></control><display><type>article</type><title>Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification</title><source>Publicly Available Content Database (Proquest) (PQ_SDU_P3)</source><source>Free Full-Text Journals in Chemistry</source><creator>Wu, Hao ; Ying, Zhanfeng ; Chen, Zhihua ; Zu, Wei</creator><creatorcontrib>Wu, Hao ; Ying, Zhanfeng ; Chen, Zhihua ; Zu, Wei</creatorcontrib><description>To swiftly and precisely assess the IGBT’s thermal safety during the circuit design phase, this paper proposes a method of establishing an IGBT thermal network model by electrothermal coupling simulation and parameter identification. This model integrates electrothermal coupling simulation techniques and parameter identification methods. Firstly, the IGBT’s finite element model is established by COMSOL, aiming to acquire the temperature distribution patterns of the IGBT and its heat sink under various operating conditions. Then, the objective function of parameter identification is constructed. The IGBT thermal network model’s parameters are extracted by combining the electrothermal coupling simulation results with the primal-dual interior point method. Then the device’s junction-ambient thermal network model is obtained. The proposed method’s efficacy is validated through the comparison of the results and calculation time of the thermal network model and the electrothermal coupling simulation.</description><identifier>ISSN: 1742-6588</identifier><identifier>EISSN: 1742-6596</identifier><identifier>DOI: 10.1088/1742-6596/2918/1/012028</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Circuit design ; Coupling ; Finite element method ; Heat sinks ; Identification methods ; Parameter identification ; Temperature distribution ; Thermal simulation</subject><ispartof>Journal of physics. Conference series, 2024-12, Vol.2918 (1), p.12028</ispartof><rights>Published under licence by IOP Publishing Ltd</rights><rights>Published under licence by IOP Publishing Ltd. This work is published under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c2048-9fc5044911549f5abe0177dcf68aa442ff09f72c845e83ce21149e248fab225e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/3145733316?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,25730,27900,27901,36988,44565</link.rule.ids></links><search><creatorcontrib>Wu, Hao</creatorcontrib><creatorcontrib>Ying, Zhanfeng</creatorcontrib><creatorcontrib>Chen, Zhihua</creatorcontrib><creatorcontrib>Zu, Wei</creatorcontrib><title>Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification</title><title>Journal of physics. Conference series</title><addtitle>J. Phys.: Conf. Ser</addtitle><description>To swiftly and precisely assess the IGBT’s thermal safety during the circuit design phase, this paper proposes a method of establishing an IGBT thermal network model by electrothermal coupling simulation and parameter identification. This model integrates electrothermal coupling simulation techniques and parameter identification methods. Firstly, the IGBT’s finite element model is established by COMSOL, aiming to acquire the temperature distribution patterns of the IGBT and its heat sink under various operating conditions. Then, the objective function of parameter identification is constructed. The IGBT thermal network model’s parameters are extracted by combining the electrothermal coupling simulation results with the primal-dual interior point method. Then the device’s junction-ambient thermal network model is obtained. The proposed method’s efficacy is validated through the comparison of the results and calculation time of the thermal network model and the electrothermal coupling simulation.</description><subject>Circuit design</subject><subject>Coupling</subject><subject>Finite element method</subject><subject>Heat sinks</subject><subject>Identification methods</subject><subject>Parameter identification</subject><subject>Temperature distribution</subject><subject>Thermal simulation</subject><issn>1742-6588</issn><issn>1742-6596</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><recordid>eNqFkNFKwzAUhosoOKfPYMA7YS5J0za91DHnZKDgvA5peuIy26YmLSK-vJnTiSCYmySc7_w_fFF0SvAFwZyPScboKE3ydExzEr5jTCimfC8a7Cb7uzfnh9GR92uM43CyQfQ-9Z0sKuNXNTQdqqFb2RJZjeazqyXqVuBqWaEGulfrnlFtS6hQIT0EpkFQgeqc_aaU7dvKNE_Im7qvZGcCIpsStdLJEAwOmTKUGG3U5_A4OtCy8nDydQ-jx-vpcnIzWtzN5pPLxUhRzPgo1yrBjOWEJCzXiSwAkywrlU65lIxRrXGuM6o4S4DHCighLAfKuJYFpQnEw-hsm9s6-9KD78Ta9q4JlSImLMmCCZIGKttSylnvHWjROlNL9yYIFhvTYuNQbHyKjWlBxNZ02Dzfbhrb_kTf3k8efoOiLXWA4z_g_yo-APifj70</recordid><startdate>20241201</startdate><enddate>20241201</enddate><creator>Wu, Hao</creator><creator>Ying, Zhanfeng</creator><creator>Chen, Zhihua</creator><creator>Zu, Wei</creator><general>IOP Publishing</general><scope>O3W</scope><scope>TSCCA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>H8D</scope><scope>HCIFZ</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PHGZM</scope><scope>PHGZT</scope><scope>PIMPY</scope><scope>PKEHL</scope><scope>PQEST</scope><scope>PQGLB</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope></search><sort><creationdate>20241201</creationdate><title>Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification</title><author>Wu, Hao ; Ying, Zhanfeng ; Chen, Zhihua ; Zu, Wei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2048-9fc5044911549f5abe0177dcf68aa442ff09f72c845e83ce21149e248fab225e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Circuit design</topic><topic>Coupling</topic><topic>Finite element method</topic><topic>Heat sinks</topic><topic>Identification methods</topic><topic>Parameter identification</topic><topic>Temperature distribution</topic><topic>Thermal simulation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wu, Hao</creatorcontrib><creatorcontrib>Ying, Zhanfeng</creatorcontrib><creatorcontrib>Chen, Zhihua</creatorcontrib><creatorcontrib>Zu, Wei</creatorcontrib><collection>Institute of Physics - IOP eJournals - Open Access</collection><collection>IOPscience (Open Access)</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>Advanced Technologies & Aerospace Database (1962 - current)</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection (ProQuest)</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>Aerospace Database</collection><collection>SciTech Premium Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central (New)</collection><collection>ProQuest One Academic (New)</collection><collection>Publicly Available Content Database (Proquest) (PQ_SDU_P3)</collection><collection>ProQuest One Academic Middle East (New)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Applied & Life Sciences</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><jtitle>Journal of physics. Conference series</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wu, Hao</au><au>Ying, Zhanfeng</au><au>Chen, Zhihua</au><au>Zu, Wei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification</atitle><jtitle>Journal of physics. Conference series</jtitle><addtitle>J. Phys.: Conf. Ser</addtitle><date>2024-12-01</date><risdate>2024</risdate><volume>2918</volume><issue>1</issue><spage>12028</spage><pages>12028-</pages><issn>1742-6588</issn><eissn>1742-6596</eissn><abstract>To swiftly and precisely assess the IGBT’s thermal safety during the circuit design phase, this paper proposes a method of establishing an IGBT thermal network model by electrothermal coupling simulation and parameter identification. This model integrates electrothermal coupling simulation techniques and parameter identification methods. Firstly, the IGBT’s finite element model is established by COMSOL, aiming to acquire the temperature distribution patterns of the IGBT and its heat sink under various operating conditions. Then, the objective function of parameter identification is constructed. The IGBT thermal network model’s parameters are extracted by combining the electrothermal coupling simulation results with the primal-dual interior point method. Then the device’s junction-ambient thermal network model is obtained. The proposed method’s efficacy is validated through the comparison of the results and calculation time of the thermal network model and the electrothermal coupling simulation.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/1742-6596/2918/1/012028</doi><tpages>10</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Circuit design Coupling Finite element method Heat sinks Identification methods Parameter identification Temperature distribution Thermal simulation |
title | Establishment method of IGBT thermal network model based on electrothermal coupling simulation and parameter identification |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-25T11%3A34%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Establishment%20method%20of%20IGBT%20thermal%20network%20model%20based%20on%20electrothermal%20coupling%20simulation%20and%20parameter%20identification&rft.jtitle=Journal%20of%20physics.%20Conference%20series&rft.au=Wu,%20Hao&rft.date=2024-12-01&rft.volume=2918&rft.issue=1&rft.spage=12028&rft.pages=12028-&rft.issn=1742-6588&rft.eissn=1742-6596&rft_id=info:doi/10.1088/1742-6596/2918/1/012028&rft_dat=%3Cproquest_cross%3E3145733316%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c2048-9fc5044911549f5abe0177dcf68aa442ff09f72c845e83ce21149e248fab225e3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=3145733316&rft_id=info:pmid/&rfr_iscdi=true |