In-situ Release Technology for MEMS Sensor Using Carbonate Thermal Decomposition Materials

This work aims to introduce for the first time the concept of "in-situ release" for MEMS sensors, and validate the feasibility of this technology using an accelerometer structure with modified design. MEMS sensors enhanced with in-situ release technology will be able to fix its movable str...

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Bibliographic Details
Published in:IEEE sensors journal 2024-01, Vol.24 (24), p.1-1
Main Authors: Xie, Cheng, Zhou, Kaiyue, Li, Jia, Wang, Weibing
Format: Article
Language:English
Subjects:
Accelerometers
Decomposition
Fabrication
Feasibility studies
Heating systems
In-situ release
MEMS sensor
Microelectromechanical systems
microheater
Micromechanical devices
Periodic structures
Sensors
Solvents
Technology assessment
Temperature sensors
Testing
Thermal decomposition
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Summary:This work aims to introduce for the first time the concept of "in-situ release" for MEMS sensors, and validate the feasibility of this technology using an accelerometer structure with modified design. MEMS sensors enhanced with in-situ release technology will be able to fix its movable structures in place using thermally decomposable materials during the fabrication process and can be released as needed during their operational phase on boards thereby enhancing the ability of the fragile MEMS structures to withstand acceleration overload events. This research covers the entire process of the in-situ release technology including the selection and formulation of thermally decomposable materials, the development of a precise droplet addition system for the materials, the design and fabrication of a verification structure with microheaters, and the final testing phase. Driven by voltage signal, the microheaters functioned effectively, enabling the efficient decomposition of the thermally decomposable material and the restoration of the structure's mobility. The decomposition process was documented and analyzed, thereby validating the feasibility of the in-situ release technology.
ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2024.3478168