Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability

The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2009-05, Vol.32 (2), p.360-361
Main Author: Nguyen, Luu T.
Format: Article
Language:English
Subjects:
Cellular phones
Electronic equipment testing
Electronics packaging
Employee welfare
Integrated circuit interconnections
Manufacturing
Reliability engineering
Semiconductor device packaging
Thermal management
Wafer scale integration
Online Access:Get full text
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Description
Summary:The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2009.2022602