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Direct Analysis Technique for Long-Finger HBT by Electromagnetic and Device Co-Simulation

This paper presents a direct-analysis technique for transistors with a long-finger structure. The analysis technique is an incorporated simulation between the finite-difference time-domain electromagnetic (EM) and semiconductor device simulations. The co-simulation method can consider various EM cou...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2008-04, Vol.56 (4), p.747-754
Main Authors: Shinohara, Y., Ishikawa, R., Honjo, K.
Format: Article
Language:English
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Summary:This paper presents a direct-analysis technique for transistors with a long-finger structure. The analysis technique is an incorporated simulation between the finite-difference time-domain electromagnetic (EM) and semiconductor device simulations. The co-simulation method can consider various EM couplings and phase shifts on finger electrodes of transistors. The method was applied for InGaP/GaAs HBTs with various finger lengths to investigate gain degradation characteristics as a function of the finger length. As the first step, circuit simulations were done instead of a semiconductor device simulation using SPICE models of the HBT. Both large- and small-signal equivalent-circuit parameters were extracted by measurements to estimate nonlinear and linear characteristics, respectively. Using the extracted small-signal parameters, the gain degradation was estimated. The co-simulation results showed the same tendency as measurement results. Additionally, it was numerically shown that a resistive loss was mainly affected for the gain degradation from a comparison between gold and lossless electrodes.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2008.919080