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Effect of (Au, Ni)Sn 4 Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions

The ternary intermetallic compound Au0.5Ni0.5Sn4 forms at the Sn-37Pb/ENIG solder interface during aging and temperature cycling, leading to increased interfacial cracking and a corresponding decrease in solder joint reliability for 15 mm ball grid array (BGA) structures.

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2007-03, Vol.30 (1), p.32
Main Authors: Davis, J.A, Bozack, M.J, Evans, J.L
Format: Article
Language:English
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Description
Summary:The ternary intermetallic compound Au0.5Ni0.5Sn4 forms at the Sn-37Pb/ENIG solder interface during aging and temperature cycling, leading to increased interfacial cracking and a corresponding decrease in solder joint reliability for 15 mm ball grid array (BGA) structures.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2007.892065