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Effect of (Au, Ni)Sn 4 Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions
The ternary intermetallic compound Au0.5Ni0.5Sn4 forms at the Sn-37Pb/ENIG solder interface during aging and temperature cycling, leading to increased interfacial cracking and a corresponding decrease in solder joint reliability for 15 mm ball grid array (BGA) structures.
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Published in: | IEEE transactions on components and packaging technologies 2007-03, Vol.30 (1), p.32 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | The ternary intermetallic compound Au0.5Ni0.5Sn4 forms at the Sn-37Pb/ENIG solder interface during aging and temperature cycling, leading to increased interfacial cracking and a corresponding decrease in solder joint reliability for 15 mm ball grid array (BGA) structures. |
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ISSN: | 1521-3331 1557-9972 |
DOI: | 10.1109/TCAPT.2007.892065 |