Flexible pillars for displacement compensation in optical chip assembly

In chip-to-chip optical interconnect systems with surface mounted light-sources and detectors, thermal and mechanical effects can cause lateral displacements of the assembled devices. These displacements can result in optical signal losses that can critically deteriorate the bit-error-rate of the di...

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Bibliographic Details
Published in:IEEE photonics technology letters 2006-04, Vol.18 (8), p.974-976
Main Authors: Glebov, A.L., Bhusari, D., Kohl, P., Bakir, M.S., Meindl, J.D., Lee, M.G.
Format: Article
Language:English
Subjects:
Assembly systems
Bit error rate
Budgeting
Compensation
Detectors
Devices
Displacement
High speed optical techniques
Optical assembly and packaging
Optical interconnections
Optical interconnects
optical interconnects (OIs)
Optical losses
Optical polymers
Optical sensors
Optical waveguides
Photonics
Pillars
polymers
Surface-mount technology
Vertical cavity surface emitting lasers
waveguides
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Summary:In chip-to-chip optical interconnect systems with surface mounted light-sources and detectors, thermal and mechanical effects can cause lateral displacements of the assembled devices. These displacements can result in optical signal losses that can critically deteriorate the bit-error-rate of the digital system. We demonstrate that, for a given loss budget of 1 dB, the use of flexible optical pillars with 150-μm height and 50-μm diameter can double the lateral displacement tolerance from about 15 to 30 μm. The pillars fabricated from Avatrel polymer form an air-free path between the light source and the substrate and cause maximum optical power losses less than 0.2 dB.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2006.873563