Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode Laser

Anisotropic conductive film (ACF) bonding between liquid crystal displays (LCDs) and driver integrated circuits (ICs) is one of the key technologies for developing high-resolution LCDs. The bonding pitch between LCD and tape carrier package (TCP), which influences the total reliability of LCD module...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2006-11, Vol.29 (4), p.701-706
Main Authors: Ryu, Kwang Hyun, Kwon, Namic, Seo, Myung Hee, Lee, Myung Hoon, Nam, Gi Jung, Kwak, No Heung
Format: Article
Language:English
Subjects:
Anisotropic conductive film (ACF) bonding
Anisotropic conductive films
Anisotropy
Applied sciences
Bonding
Circuit properties
Circuits of signal characteristics conditioning (including delay circuits)
Curing
Design. Technologies. Operation analysis. Testing
Diode lasers
Display
Driver circuits
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Exact sciences and technology
film on glass bonding
high-power diode laser
Integrated circuit packaging
Integrated circuit reliability
Integrated circuit technology
Integrated circuits
laser bonding
Lasers
LCDs
liquid crystal display (LCD) packaging
Liquid crystal displays
Other multijunction devices. Power transistors. Thyristors
Packages
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
TCP (protocol)
Temperature
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Description
Summary:Anisotropic conductive film (ACF) bonding between liquid crystal displays (LCDs) and driver integrated circuits (ICs) is one of the key technologies for developing high-resolution LCDs. The bonding pitch between LCD and tape carrier package (TCP), which influences the total reliability of LCD modules, depends on the characteristics and bonding conditions of ACF used. So, the bonding process between TCP and a glass panel with ACF using a high-power diode laser as a heat source for curing is preliminarily tested in this experiment. Also, laser transient thermal simulation was performed to analyze the thermal response of the assembly process for a package using ACF. The temperature on the ACF layer goes up to 180 degC (ACF curing temperature) within 1 s after exposure to laser light. This paper reports an effective bonding method using a diode laser, which accomplishes a fine-pitch ACF bonding and determines the optimum ACF bonding condition effectively
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2006.884825