Uncooled mini-DIL module for 980-nm pump lasers

The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost,...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2006-02, Vol.29 (1), p.171-177
Main Authors: Jin Li, Brattain, M., Rice, A.K., Labudovic, M., Young, J.R., Cook, M., Fan Ye, Davis, M.K., Burka, M.
Format: Article
Language:English
Subjects:
Aluminum gallium arsenides
Amplifiers
Applied sciences
Circuit properties
Costs
Devices
Electric power generation
Electric, optical and optoelectronic circuits
Electrical engineering. Electrical power engineering
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Erbium-doped fiber amplifier
Erbium-doped fiber lasers
Exact sciences and technology
Finite-element method
Fundamental areas of phenomenology (including applications)
Integrated optics. Optical fibers and wave guides
Laser excitation
Laser modes
Lasers
Mathematical models
miniature dual-inline (Mini-DIL)
Modules
Optical and optoelectronic circuits
Optical design
Optics
Physics
Power electronics, power supplies
Power generation
Power lasers
Pump lasers
Pumps
semiconductor laser
Semiconductor lasers
laser diodes
Thermal stresses
uncooled laser
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Summary:The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost, smaller footprint, minimal heat generation, and reduced electrical power consumption. In this paper, we report a low-cost uncooled Mini-DIL module designed for 980-nm pump lasers. A three-dimensional finite element analysis model effectively predicts module thermal and stress performance. Experimental results of module power and coupling efficiency stability over assembly processes are presented. A minimum optical output power of 150 mW is achieved in a group of 10 devices across a temperature range of 0/spl deg/C to 70/spl deg/C at a drive current of 350 mA with a 1.5-mm raised ridge InGaAs/AlGaAs single quantum well laser chip.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2005.849565