Silicon heat pipes used as thermal spreaders

An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Models of the structure were developed to calculate...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2003-06, Vol.26 (2), p.332-339
Main Authors: Gillot, C., Avenas, Y., Cezac, N., Poupon, G., Schaeffer, C., Fournier, E.
Format: Article
Language:English
Subjects:
Density
Heat pipes
Heat sinks
Heat transfer
Hydraulic diameter
Insulated gate bipolar transistors
Mathematical models
Miniaturization
Prototypes
Silicon
Spreads
Temperature
Thermal conductivity
Thermal resistance
Water heating
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Summary:An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Models of the structure were developed to calculate heat transfer limitations and temperature drops. A brass/water prototype was fabricated to demonstrate the feasibility of heat spreading using this type of heat pipe. Simulation and experimental results obtained with the prototype are described. The dissipated power reached 110 W/cm/sup 2/ without heat transfer limitations. The results are then extended to the design of this type of heat pipe in silicon. Thermal performance was calculated. Simulation, experimental results and the fabrication process are presented.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2003.815092