Finite element contact analysis on a horn-holder assembly for wire bonding

The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify the accuracy of a proposed computation relative to m...

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2003-01, Vol.26 (1), p.46-53
Main Authors: Jang, Changsoo, Ahn, Geun Sik, Kim, Yung Joon, Kwak, Dong Ok, Booh, Seong Woon, Kim, Jae Ok
Format: Article
Language:English
Subjects:
Acoustic wave devices, piezoelectric and piezoresistive devices
Applied sciences
Assembly
Bonding
Bosses
Boundary conditions
Computation
Contact
Electronics
Exact sciences and technology
Finite element method
Finite element methods
Guidelines
Mathematical analysis
Mathematical models
Parametric study
Physics computing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Stress
Transducers
Wire
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Summary:The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify the accuracy of a proposed computation relative to measurement. After validation, a two-dimensional model was built to conduct parametric studies and improve the efficiency and speed of the computation. Several factors such as boundary conditions, modeling boundary, and mesh density, were considered to obtain consistency with the three-dimensional analysis. Arc angle and the position of each holder boss were chosen as design parameters. A designed computation approach was applied for efficiency in computation. As a result, a guideline for holder boss design was suggested, and the main factors and their influence on stress concentration in the transducer horn were surveyed.
ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2003.812999