Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical model...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2002-12, Vol.25 (4), p.569-575
Main Authors: Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F.
Format: Article
Language:English
Subjects:
Communities
Computer aided manufacturing
Computer architecture
Electronic packaging thermal management
Electronic systems
Electronics cooling
Hardware
High performance computing
Internet
Numerical models
Packaging
Panels
Thermal management
Thermal management of electronics
Transport
Workshops
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Summary:The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and Internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2003.809113