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Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array

A unique electromagnetic (EM)-electrothermal global simulation tool based on a universal error concept is presented. The advantages of this electrothermal model are illustrated by comparison with a commercial electrothermal circuit simulator. The first description of a fully physical, electrothermal...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2002-12, Vol.50 (12), p.2820-2833
Main Authors: Batty, W., Christoffersen, C.E., Yakovlev, A.B., Whitaker, J.F., Mortazawi, A., Al-Zayed, A., Ozkar, M., Ortiz, S.C., Reano, R.M., Yang, K., Katehi, L.P.B., Snowden, C.M., Steer, M.B.
Format: Article
Language:English
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Summary:A unique electromagnetic (EM)-electrothermal global simulation tool based on a universal error concept is presented. The advantages of this electrothermal model are illustrated by comparison with a commercial electrothermal circuit simulator. The first description of a fully physical, electrothermal, microwave circuit simulation, based on coupling of the Leeds Physical Model of MESFETs and high electron-mobility transistors, to a microwave circuit simulator, fREEDA (NCSU), is presented. The modeling effort is supported by parallel developments in electrooptic and thermal measurement. The first fully coupled EM-electrothermal global simulation of a large microwave subsystem, here a whole spatial power combining monolithic-microwave integrated-circuit (MMIC) array, is described. The simulation is partially validated by measurements of MMIC array temperature rise and temperature dependent S-parameters. Electrothermal issues for spatial power combiner operation and modeling are discussed. The computer-aided-design tools and experimental characterization described, provide a unique capability for the design of quasi-optical systems and for the exploration of the fundamental physics of spatial power combining devices.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2002.805142