Modeling of simultaneous switching noise in high speed systems

Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex: due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, packag...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2001-05, Vol.24 (2), p.132-142
Main Authors: Sungjun Chun, Swaminathan, M., Smith, L.D., Srinivasan, J., Zhang Jin, Iyer, M.K.
Format: Article
Language:English
Subjects:
Applied sciences
Complex systems
Computational modeling
Computer simulation
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Electronics packaging
Exact sciences and technology
Frequency
High speed
Inductance
Integrated circuit interconnections
Integrated circuit noise
Mathematical analysis
Mathematical models
Noise
Power system modeling
Semiconductor device noise
Skin effect
Switches
Switching
Switching circuits
Testing, measurement, noise and reliability
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Summary:Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex: due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.928747