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Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications
The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow di...
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Published in: | IEEE electron device letters 2009-03, Vol.30 (3), p.302-304 |
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container_title | IEEE electron device letters |
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creator | Hyejung Choi Myeongbum Pyun Tae-Wook Kim Hasan, M. Rui Dong Joonmyoung Lee Ju-Bong Park Jaesik Yoon Dong-jun Seong Takhee Lee Hyunsang Hwang |
description | The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow distribution of set and reset voltages in the nanoscale junction. In addition, we investigated the area dependence of operation current. Based on these results and current-voltage dependence on temperature, we discussed a potential switching mechanism of Cu-C layer. |
doi_str_mv | 10.1109/LED.2008.2012273 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_912023066</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4785231</ieee_id><sourcerecordid>34498936</sourcerecordid><originalsourceid>FETCH-LOGICAL-c417t-149dc10ff308afb355a168216eaa00aff8cf3c978956ca9b39cda75262e0dca43</originalsourceid><addsrcrecordid>eNpdkE1vEzEQhi0EEqFwR-JiIcFty_hjvetjlRZaKS0SH2czccbgarNe7E0h_x5HiXrgMiPNPPNq9DD2WsC5EGA_rK4uzyVAX4uQslNP2EK0bd9Aa9RTtoBOi0YJMM_Zi1LuAYTWnV6wH3c4puJxIP6FSixzfCD-9U-c_a84_uQpcOTLNE2UmyXmdRqb2_iXNnyFe8o8pMzv0viQBpxjjbilbcp7fjFNQ_R1lMbykj0LOBR6depn7PvHq2_L62b1-dPN8mLVeC26uRHabryAEBT0GNaqbVGYXgpDiAAYQu-D8rbrbWs82rWyfoNdK40k2HjU6oy9P-ZOOf3eUZndNhZPw4AjpV1xSmvbW2Uq-PY_8D7t8lh_c1ZIkArMAYIj5HMqJVNwU45bzHsnwB18u-rbHXy7k-968u6UiwefIePoY3m8k6L6BtNV7s2Ri0T0uNZd30ol1D_HYojY</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>912023066</pqid></control><display><type>article</type><title>Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications</title><source>IEEE Electronic Library (IEL) Journals</source><creator>Hyejung Choi ; Myeongbum Pyun ; Tae-Wook Kim ; Hasan, M. ; Rui Dong ; Joonmyoung Lee ; Ju-Bong Park ; Jaesik Yoon ; Dong-jun Seong ; Takhee Lee ; Hyunsang Hwang</creator><creatorcontrib>Hyejung Choi ; Myeongbum Pyun ; Tae-Wook Kim ; Hasan, M. ; Rui Dong ; Joonmyoung Lee ; Ju-Bong Park ; Jaesik Yoon ; Dong-jun Seong ; Takhee Lee ; Hyunsang Hwang</creatorcontrib><description>The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow distribution of set and reset voltages in the nanoscale junction. In addition, we investigated the area dependence of operation current. Based on these results and current-voltage dependence on temperature, we discussed a potential switching mechanism of Cu-C layer.</description><identifier>ISSN: 0741-3106</identifier><identifier>EISSN: 1558-0563</identifier><identifier>DOI: 10.1109/LED.2008.2012273</identifier><identifier>CODEN: EDLEDZ</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Cell array ; Conducting materials ; Copper ; copper-carbon-mixed (Cu-C) layer ; Design. Technologies. Operation analysis. Testing ; Electronics ; Energy consumption ; Exact sciences and technology ; Insulation ; Integrated circuits ; Integrated circuits by function (including memories and processors) ; Materials science and technology ; Nonvolatile memory ; Random access memory ; resistance random access memory ; resistive switching ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Solid state circuits ; Temperature measurement ; Voltage</subject><ispartof>IEEE electron device letters, 2009-03, Vol.30 (3), p.302-304</ispartof><rights>2009 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c417t-149dc10ff308afb355a168216eaa00aff8cf3c978956ca9b39cda75262e0dca43</citedby><cites>FETCH-LOGICAL-c417t-149dc10ff308afb355a168216eaa00aff8cf3c978956ca9b39cda75262e0dca43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4785231$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21474067$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Hyejung Choi</creatorcontrib><creatorcontrib>Myeongbum Pyun</creatorcontrib><creatorcontrib>Tae-Wook Kim</creatorcontrib><creatorcontrib>Hasan, M.</creatorcontrib><creatorcontrib>Rui Dong</creatorcontrib><creatorcontrib>Joonmyoung Lee</creatorcontrib><creatorcontrib>Ju-Bong Park</creatorcontrib><creatorcontrib>Jaesik Yoon</creatorcontrib><creatorcontrib>Dong-jun Seong</creatorcontrib><creatorcontrib>Takhee Lee</creatorcontrib><creatorcontrib>Hyunsang Hwang</creatorcontrib><title>Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications</title><title>IEEE electron device letters</title><addtitle>LED</addtitle><description>The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow distribution of set and reset voltages in the nanoscale junction. In addition, we investigated the area dependence of operation current. Based on these results and current-voltage dependence on temperature, we discussed a potential switching mechanism of Cu-C layer.</description><subject>Applied sciences</subject><subject>Cell array</subject><subject>Conducting materials</subject><subject>Copper</subject><subject>copper-carbon-mixed (Cu-C) layer</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Energy consumption</subject><subject>Exact sciences and technology</subject><subject>Insulation</subject><subject>Integrated circuits</subject><subject>Integrated circuits by function (including memories and processors)</subject><subject>Materials science and technology</subject><subject>Nonvolatile memory</subject><subject>Random access memory</subject><subject>resistance random access memory</subject><subject>resistive switching</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Solid state circuits</subject><subject>Temperature measurement</subject><subject>Voltage</subject><issn>0741-3106</issn><issn>1558-0563</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNpdkE1vEzEQhi0EEqFwR-JiIcFty_hjvetjlRZaKS0SH2czccbgarNe7E0h_x5HiXrgMiPNPPNq9DD2WsC5EGA_rK4uzyVAX4uQslNP2EK0bd9Aa9RTtoBOi0YJMM_Zi1LuAYTWnV6wH3c4puJxIP6FSixzfCD-9U-c_a84_uQpcOTLNE2UmyXmdRqb2_iXNnyFe8o8pMzv0viQBpxjjbilbcp7fjFNQ_R1lMbykj0LOBR6depn7PvHq2_L62b1-dPN8mLVeC26uRHabryAEBT0GNaqbVGYXgpDiAAYQu-D8rbrbWs82rWyfoNdK40k2HjU6oy9P-ZOOf3eUZndNhZPw4AjpV1xSmvbW2Uq-PY_8D7t8lh_c1ZIkArMAYIj5HMqJVNwU45bzHsnwB18u-rbHXy7k-968u6UiwefIePoY3m8k6L6BtNV7s2Ri0T0uNZd30ol1D_HYojY</recordid><startdate>20090301</startdate><enddate>20090301</enddate><creator>Hyejung Choi</creator><creator>Myeongbum Pyun</creator><creator>Tae-Wook Kim</creator><creator>Hasan, M.</creator><creator>Rui Dong</creator><creator>Joonmyoung Lee</creator><creator>Ju-Bong Park</creator><creator>Jaesik Yoon</creator><creator>Dong-jun Seong</creator><creator>Takhee Lee</creator><creator>Hyunsang Hwang</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20090301</creationdate><title>Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications</title><author>Hyejung Choi ; Myeongbum Pyun ; Tae-Wook Kim ; Hasan, M. ; Rui Dong ; Joonmyoung Lee ; Ju-Bong Park ; Jaesik Yoon ; Dong-jun Seong ; Takhee Lee ; Hyunsang Hwang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c417t-149dc10ff308afb355a168216eaa00aff8cf3c978956ca9b39cda75262e0dca43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Applied sciences</topic><topic>Cell array</topic><topic>Conducting materials</topic><topic>Copper</topic><topic>copper-carbon-mixed (Cu-C) layer</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Energy consumption</topic><topic>Exact sciences and technology</topic><topic>Insulation</topic><topic>Integrated circuits</topic><topic>Integrated circuits by function (including memories and processors)</topic><topic>Materials science and technology</topic><topic>Nonvolatile memory</topic><topic>Random access memory</topic><topic>resistance random access memory</topic><topic>resistive switching</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Solid state circuits</topic><topic>Temperature measurement</topic><topic>Voltage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hyejung Choi</creatorcontrib><creatorcontrib>Myeongbum Pyun</creatorcontrib><creatorcontrib>Tae-Wook Kim</creatorcontrib><creatorcontrib>Hasan, M.</creatorcontrib><creatorcontrib>Rui Dong</creatorcontrib><creatorcontrib>Joonmyoung Lee</creatorcontrib><creatorcontrib>Ju-Bong Park</creatorcontrib><creatorcontrib>Jaesik Yoon</creatorcontrib><creatorcontrib>Dong-jun Seong</creatorcontrib><creatorcontrib>Takhee Lee</creatorcontrib><creatorcontrib>Hyunsang Hwang</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE electron device letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hyejung Choi</au><au>Myeongbum Pyun</au><au>Tae-Wook Kim</au><au>Hasan, M.</au><au>Rui Dong</au><au>Joonmyoung Lee</au><au>Ju-Bong Park</au><au>Jaesik Yoon</au><au>Dong-jun Seong</au><au>Takhee Lee</au><au>Hyunsang Hwang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications</atitle><jtitle>IEEE electron device letters</jtitle><stitle>LED</stitle><date>2009-03-01</date><risdate>2009</risdate><volume>30</volume><issue>3</issue><spage>302</spage><epage>304</epage><pages>302-304</pages><issn>0741-3106</issn><eissn>1558-0563</eissn><coden>EDLEDZ</coden><abstract>The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow distribution of set and reset voltages in the nanoscale junction. In addition, we investigated the area dependence of operation current. Based on these results and current-voltage dependence on temperature, we discussed a potential switching mechanism of Cu-C layer.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/LED.2008.2012273</doi><tpages>3</tpages></addata></record> |
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subjects | Applied sciences Cell array Conducting materials Copper copper-carbon-mixed (Cu-C) layer Design. Technologies. Operation analysis. Testing Electronics Energy consumption Exact sciences and technology Insulation Integrated circuits Integrated circuits by function (including memories and processors) Materials science and technology Nonvolatile memory Random access memory resistance random access memory resistive switching Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid state circuits Temperature measurement Voltage |
title | Nanoscale Resistive Switching of a Copper-Carbon-Mixed Layer for Nonvolatile Memory Applications |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T04%3A48%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Nanoscale%20Resistive%20Switching%20of%20a%20Copper-Carbon-Mixed%20Layer%20for%20Nonvolatile%20Memory%20Applications&rft.jtitle=IEEE%20electron%20device%20letters&rft.au=Hyejung%20Choi&rft.date=2009-03-01&rft.volume=30&rft.issue=3&rft.spage=302&rft.epage=304&rft.pages=302-304&rft.issn=0741-3106&rft.eissn=1558-0563&rft.coden=EDLEDZ&rft_id=info:doi/10.1109/LED.2008.2012273&rft_dat=%3Cproquest_cross%3E34498936%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c417t-149dc10ff308afb355a168216eaa00aff8cf3c978956ca9b39cda75262e0dca43%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=912023066&rft_id=info:pmid/&rft_ieee_id=4785231&rfr_iscdi=true |