Dielectric Thermal Analysis as a Tool for Quantitative Evaluation of the Viscosity and the Kinetics of Epoxy Resin Cure

Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation process...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2006-06, Vol.16 (2), p.1786-1789
Main Authors: Shigue, C.Y., dos Santos, R.G.S., de Abreu, M.M.S.P., Baldan, C.A., Robin, A.L.M., Ruppert-Filho, E.
Format: Article
Language:English
Subjects:
Applied sciences
Complex impedance
Composite materials
Curing
curing extent degree
dielectric analysis
Dielectrics
Dynamics
Electrical engineering. Electrical power engineering
Electromagnets
epoxy curing
Epoxy resins
Exact sciences and technology
Fabrication
Impedance
Kinetic theory
Magnetic analysis
Materials
Monitoring
Quantitative evaluation
Rheology
Thermal analysis
Various equipment and components
Viscosity
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Summary:Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2005.869624