Introduction to the Special Issue on Thermal Management for Reliability

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Bibliographic Details
Published in:IEEE transactions on device and materials reliability 2004-12, Vol.4 (4), p.566-567
Main Author: Boudreaux, P.J.
Format: Magazinearticle
Language:English
Subjects:
Cooling
Integrated circuit reliability
Integrated circuit technology
Materials reliability
Reliability engineering
Special issues and sections
Technology management
Thermal force
Thermal management
Thermal resistance
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ISSN:1530-4388
1558-2574
DOI:10.1109/TDMR.2004.839127