Observation of vortex distribution in samples of Bi-2223 Ag-sheathed tapes with and without uranium doping by means of the high-resolution Bitter method

We examined the distribution of vortices in both Bi-2223 Ag-sheathed tape and U-doped Bi-2223 Ag-sheathed tape applying the high-resolution Bitter method. In the low temperature region (T/spl Lt/T/sub c/), we found that the vortices in the undoped Bi-2223 Ag-sheathed tape developed into either a tri...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2003-06, Vol.13 (2), p.2953-2955
Main Authors: Ohshima, S., Ujiie, K., Kawai, T., Moriai, K., Yamada, H., Marinaro, D.G., Dou, S.X.
Format: Article
Language:English
Subjects:
Applied sciences
Australia
Bi-based cuprates
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Cuprates superconductors (high tc and insulating parent compounds)
Doping
Electrical engineering. Electrical power engineering
Exact sciences and technology
Fabrication
High temperature superconductors
Kinetic energy
Magnetic fields
Materials
Neutrons
Physics
Pressure control
Superconducting magnets
Superconducting materials
Superconductivity
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Summary:We examined the distribution of vortices in both Bi-2223 Ag-sheathed tape and U-doped Bi-2223 Ag-sheathed tape applying the high-resolution Bitter method. In the low temperature region (T/spl Lt/T/sub c/), we found that the vortices in the undoped Bi-2223 Ag-sheathed tape developed into either a triangular arrangement or a heterogeneous arrangement along the grain boundaries of the Ag sheath, which form weak pinning centers. The vortex distribution for U-doped Bi-2223 samples was slightly different from the distribution for the undoped material. We observed some movement of the vortices in both the U-doped and the undoped Bi-2223 Ag-sheathed tapes at 50 K. At higher temperatures, T>75 K, the vortices in the Bi-2223 tapes moved even faster so that no deposition pattern, indicating the location for vortices, formed.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2003.812073