Adsorption of Copper (II) Ions onto Surfactant-Modified Oil Palm Leaf Powder

Il palm leaf powder (OPLP), an agricultural solid waste was used as adsorbent for the removal of copper (II) ions after modification with an anionic surfactant, sodium dodecyl benzene sulfonate (SDBS), CH 3 (CH 2 ) 11 C 6 H 4 SO 3 Na. The copper (II) ions adsorption is highly dependent on pH and max...

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Bibliographic Details
Published in:Journal of dispersion science and technology 2011-11, Vol.32 (11), p.1641-1648
Main Authors: Rafatullah, M., Sulaiman, O., Hashim, R., Amini, M. H. M.
Format: Article
Language:English
Subjects:
Adsorbents
Adsorption
Agricultural wastes
Chemistry
Colloidal state and disperse state
Copper
copper (II)
Exact sciences and technology
General and physical chemistry
Isotherms
kinetic
Mathematical models
oil palm leaf
Palm
Regression coefficients
Sodium
Sodium dodecylbenzenesulfonate
Solid wastes
Surface physical chemistry
surfactant
Surfactants
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Summary:Il palm leaf powder (OPLP), an agricultural solid waste was used as adsorbent for the removal of copper (II) ions after modification with an anionic surfactant, sodium dodecyl benzene sulfonate (SDBS), CH 3 (CH 2 ) 11 C 6 H 4 SO 3 Na. The copper (II) ions adsorption is highly dependent on pH and maximum removal was observed at pH 6, above which copper (II) started to precipitate. The equilibrium adsorption data were fitted into the Langmuir and Freundlich isotherms. The Freundlich isotherm model fitted well to data with 0.989 regression coefficient (R 2 ). The kinetics of the adsorption of copper (II) ions onto the surfactant-modified OPLP was best described by a pseudo-second-order model. Comparison of this SDBS-modified-OPLP to previously investigated adsorbents showed comparably good result, offering this material as a promising adsorbent for the treatment of waste waters containing lower concentrations of copper (II) ions.
ISSN:0193-2691
1532-2351
DOI:10.1080/01932691.2010.528340