The application of the analysis of potential driven particle diffusion to the strength of materials

• Published in: Strength, fracture and complexity fracture and complexity, 2011, Vol.7 (2), p.215-233
• Main Authors: Yokobori, A. Toshimitsu, Ohmi, Toshihito, Murakawa, Tsutomu, Nemoto, Takenao, Uesugi, Tomoharu, Sugiura, Ryuji
• Format: Article
• Language: English
• Subjects: Applied sciences; Circuits; Condensed matter: structure, mechanical and thermal properties; Creep (materials); Diffusion; Diffusion in solids; Exact sciences and technology; Fatigue; Fatigue, brittleness, fracture, and cracks; Fracture mechanics; Fracture mechanics (crack, fatigue, damage...); Fundamental areas of phenomenology (including applications); Hydrogen embrittlement; Large scale integration; Mechanical and acoustical properties of condensed matter; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Mechanical properties of solids; Metals. Metallurgy; Particle diffusion; Physics; Solid mechanics; Strength; Structural and continuum mechanics; Transport properties of condensed matter (nonelectronic)
• ISSN: 1567-2069; 1875-9262
• DOI: 10.3233/SFC-2011-0140

The problems of diffusion in solid are widely treated as those of numerical analyses such as mechanisms of hydrogen diffusion which causes embrittlement, boundary micro crack initiation and growth under high temperature creep condition and stress and electro-migration due to vacancy diffusion in LSI circuit. In this paper, the significance of α multiplication method which we proposed to analyze the particle diffusion problems under potential gradient and the results obtained from this method were discussed for the problems of hydrogen embrittlement, vacancy diffusion which results in creep crack damage and deformation, and line failure in LSI circuit. Furthermore, temperature characteristic of the sensitivity of particle diffusion and concentration such as hydrogen and vacancy were discussed based on this proposed analysis.