Effects of multiple carbon fillers on the electrical and thermal conductivity and tensile and flexural modulus of polycarbonate-based resins

Adding conductive carbon fillers to insulating thermoplastic polymers increases the electrical conductivity of the resulting composite, which could allow them to be used in electrostatic dissipative and semiconductive applications. In this study, three different carbon fillers (carbon black [CB], ca...

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Bibliographic Details
Published in:Journal of composite materials 2012-02, Vol.46 (3), p.331-350
Main Authors: King, Julia A., Via, Michael D., Mills, Owen P., Alpers, Daniel S., Sutherland, John W., Bogucki, Gregg R.
Format: Article
Language:English
Subjects:
Applied sciences
Carbon
Composites
Confidence intervals
Dissipation
Electrostatics
Exact sciences and technology
Fillers
Forms of application and semi-finished materials
Modulus of rupture in bending
Nanostructure
Polymer industry, paints, wood
Technology of polymers
Thermal conductivity
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Summary:Adding conductive carbon fillers to insulating thermoplastic polymers increases the electrical conductivity of the resulting composite, which could allow them to be used in electrostatic dissipative and semiconductive applications. In this study, three different carbon fillers (carbon black [CB], carbon nanotubes [CNTs], and exfoliated graphite nanoplatelets [GNPs]) were studied via three different combinations of two different fillers (CB/CNT, CB/GNP, and CNT/GNP). These filler combinations were studied via three 32 factorial designs, which considered the following loading levels: CB: 0, 2, 5 wt%; CNT: 0, 1, 5 wt%; and GNP: 0, 2, 5 wt%. These composites were compounded, injection molded, and tested for electrical and thermal conductivity (TC), and tensile and flexural modulus. All of the single fillers caused a statistically significant increase at the 95% confidence level in composite electrical and TC, and tensile and flexural modulus. Many two filler interactions had a statistically significant effect on composite electrical and TC, and tensile and flexural modulus. For example, when CB and CNT are combined into a composite, the composite tensile modulus is higher than what would be expected from the additive effect of each single filler. Five different formulations (four containing two filler combinations) could be used for electrostatic dissipative applications and seven different formulations (six containing two filler combinations) may be used for semiconductive applications.
ISSN:0021-9983
1530-793X
DOI:10.1177/0021998311422750