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Phosphorous passivation of the SiO2/4H-SiC interface

We describe experimental and theoretical studies to determine the effects of phosphorous as a passivating agent for the SiO2/4H-SiC interface. Annealing in a P2O5 ambient converts the SiO2 layer to PSG (phosphosilicate glass) which is known to be a polar material. Higher mobility (approximately twic...

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Bibliographic Details
Published in:Solid-state electronics 2012-02, Vol.68, p.103-107
Main Authors: SHARMA, Y. K, AHYI, A. C, ISSACS-SMITH, T, SHEN, X, PANTELIDES, S. T, ZHU, X, FELDMAN, L. C, ROZEN, J, WILLIAMS, J. R
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Language:English
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Summary:We describe experimental and theoretical studies to determine the effects of phosphorous as a passivating agent for the SiO2/4H-SiC interface. Annealing in a P2O5 ambient converts the SiO2 layer to PSG (phosphosilicate glass) which is known to be a polar material. Higher mobility (approximately twice the value of 30-40 cm2/V s obtained using nitrogen introduced with an anneal in nitric oxide) and lower threshold voltage are compatible with a lower interface defect density. Trap density, current-voltage and bias-temperature stress (BTS) measurements for MOS capacitors are also discussed. The BTS measurements point to the possibility of an unstable MOSFET threshold voltage caused by PSG polarization charge at the O-S interface. Theoretical considerations suggest that threefold carbon atoms at the interface can be passivated by phosphorous which leads to a lower interface trap density and a higher effective mobility for electrons in the channel. The roles of phosphorous in the passivation of correlated carbon dangling bonds, for SiC counter-doping, for interface band-tail state suppression, for Na-like impurity band formation and for substrate trap passivation are also discussed briefly.
ISSN:0038-1101
1879-2405
DOI:10.1016/j.sse.2011.10.030