Proposed ToF-SIMS/XPS standardization methods for bonding wires in electronic packaging applications

Time of Flight Secondary Ion Mass Spectrometry (ToF‐SIMS) and XPS were utilized to assess the surface characteristics of the bonding wire generally used in electronic packaging applications. This paper outlines the proposed standard methodologies for the analysis of the high‐curvature surfaces of th...

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Bibliographic Details
Published in:Surface and interface analysis 2011-01, Vol.43 (1-2), p.586-590
Main Authors: Sodhi, R., Gallaugher, M., Wang, Z., Koo, J.
Format: Article
Language:English
Subjects:
Atomic, molecular, and ion beam impact and interactions with surfaces
Bonding
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Contaminants
contamination
Electron and ion emission by liquids and solids
impact phenomena
Electronics packaging
Exact sciences and technology
Impact phenomena (including electron spectra and sputtering)
Interface analysis
microelectronic bonding wires
Photoemission and photoelectron spectra
Physics
Showcases
ToF-SIMS
Wire
X-ray photoelectron spectroscopy
XPS
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Description
Summary:Time of Flight Secondary Ion Mass Spectrometry (ToF‐SIMS) and XPS were utilized to assess the surface characteristics of the bonding wire generally used in electronic packaging applications. This paper outlines the proposed standard methodologies for the analysis of the high‐curvature surfaces of the fine bonding wires (less than 1.2 mil (30 micron) in diameter) using specially designed stages and systematic data acquisition and analysis. Examples are given to showcase the effectiveness of the methodology, which is able to differentiate various industrial process residues and contaminants on the bonding wire. A preliminary draft of the proposed standard surface characterization methods is presented. Copyright © 2010 John Wiley & Sons, Ltd.
ISSN:0142-2421
1096-9918
1096-9918
DOI:10.1002/sia.3634