Thermal Stability of Neodymium Aluminates High-κ Dielectric Deposited by Liquid Injection MOCVD Using Single-Source Heterometallic Alkoxide Precursors

Thin films of neodymium aluminate (NdAlOx) have been deposited by liquid injection metalorganic chemical vapor deposition (MOCVD) using the bimetallic alkoxide precursor [NdAl(OPri)6(PriOH)]2. The effects of high-temperature postdeposition annealing on NdAlOx thin films are reported. The as-deposite...

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Bibliographic Details
Published in:Journal of nanomaterials 2012-01, Vol.2012 (2012), p.1-4
Main Authors: Chen, Susu, Jones, A. C., Gaskell, J. M., Chalker, P. R., Werner, M., Taylor, S., Zhao, Ce Zhou, Taechakumput, P., Aspinall, H. C.
Format: Article
Language:English
Subjects:
Alkoxides
Aluminates
Annealing
Deposition
Dielectrics
Liquid injection
Precursors
Thin films
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Summary:Thin films of neodymium aluminate (NdAlOx) have been deposited by liquid injection metalorganic chemical vapor deposition (MOCVD) using the bimetallic alkoxide precursor [NdAl(OPri)6(PriOH)]2. The effects of high-temperature postdeposition annealing on NdAlOx thin films are reported. The as-deposited thin films are amorphous in nature. X-ray diffraction (XRD) and medium energy ion scattering (MEIS) show, respectively, no crystallization or interdiffusion of metal ions into the substrate after annealing at 950°C. The capacitance-voltage (C-V) and current-voltage (I-V) characteristics of the thin films exhibited good electrical integrity following annealing. The dielectric permittivity (κ) of the annealed NdAlOx was 12, and a density of interface states at flatband (Dit) of 4.01×1011 cm−2 eV−1 was measured. The deposited NdAlOx thin films are shown to be able to endure high-temperature stress and capable of maintaining excellent dielectric properties.
ISSN:1687-4110
1687-4129
DOI:10.1155/2012/891079