Crystallographic effect on subsurface damage formation in silicon microcutting

Nanoprecision plunge cutting tests were carried out on single-crystal silicon (001) samples along various directions at different tool rake angles, and subsurface damage was characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. It was found that amorph...

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Bibliographic Details
Published in:CIRP annals 2012, Vol.61 (1), p.131-134
Main Authors: Yan, Jiwang, Asami, Tooru, Harada, Hirofumi, Kuriyagawa, Tsunemoto
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Cutting
Cutting parameters
Cutting tool materials
Damage
Dislocations
Equations of state, phase equilibria, and phase transitions
Exact sciences and technology
Nanostructure
Physics
Rakes
Silicon
Single crystal
Solid-liquid transitions
Specific phase transitions
Surface integrity
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Summary:Nanoprecision plunge cutting tests were carried out on single-crystal silicon (001) samples along various directions at different tool rake angles, and subsurface damage was characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. It was found that amorphization, poly-crystallization, dislocation and internal microcracking occurred and these material responses depended strongly on the cutting direction. When cutting in the [1 1¯ 0] and [0 1¯ 0] directions, deep line defects consisting of microcracks and dislocation groups occurred even when the surface was “ductile”-cut; while for the [128 309¯ 0] direction, the damage depth was reduced by a factor of five.
ISSN:0007-8506
DOI:10.1016/j.cirp.2012.03.070