Electrochemical corrosion of Sn–0.75Cu solder joints in NaCl solution

The corrosion behaviors of Sn–0.75Cu solder and Sn–0.75Cu/Cu joint in 3.5% NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn–0.75Cu solder was lower than that of Sn–0.75Cu/Cu joint...

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Bibliographic Details
Published in:Transactions of Nonferrous Metals Society of China 2012-04, Vol.22 (4), p.977-982
Main Authors: GAO, Yan-fang, CHENG, Cong-qian, ZHAO, Jie, WANG, Li-hua, LI, Xiao-gang
Format: Article
Language:English
Subjects:
Copper
corroded products
Corrosion
Electrochemical corrosion
Leaching
leaching behavior
Pits
Polarization
potentiodynamic polarization
Sn–0.75Cu solder
Sn–0.75Cu/Cu joint
Solders
Surface chemistry
Tin base alloys
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Summary:The corrosion behaviors of Sn–0.75Cu solder and Sn–0.75Cu/Cu joint in 3.5% NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn–0.75Cu solder was lower than that of Sn–0.75Cu/Cu joint. The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O(OH)2Cl2 formed on the surface of Sn–0.75Cu solder at active dissolution stage. As the potential increased from active/passive transition stage, all the surface of Sn–0.75Cu solder was covered by the Sn3O(OH)2Cl2 and some pits appeared after the polarization test. Compared to the Sn–0.75Cu solder alloy, much more Sn3O(OH)2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn–0.75Cu/Cu solder joints. The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn–0.75Cu/Cu solder joints.
ISSN:1003-6326
DOI:10.1016/S1003-6326(11)61273-9