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The influence of thickness and ammonia flow rate on the properties of AlN layers

Undoped AlN layers have been grown on c-plane sapphire substrates by metal-organic chemical vapor deposition in order to study the effects of ammonia (NH3) flow rate and layer thickness on the structural quality and surface morphology of AlN layers by high-resolution X-ray diffraction, scanning elec...

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Bibliographic Details
Published in:Materials science in semiconductor processing 2012-02, Vol.15 (1), p.32-36
Main Authors: Aoerekci, S, Azturk, M K, Aakmak, M, Azcelik, S, Azbay, E
Format: Article
Language:English
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Summary:Undoped AlN layers have been grown on c-plane sapphire substrates by metal-organic chemical vapor deposition in order to study the effects of ammonia (NH3) flow rate and layer thickness on the structural quality and surface morphology of AlN layers by high-resolution X-ray diffraction, scanning electron microscopy, and atomic force microscopy. Lower NH3 flow rate improves crystallinity of the symmetric (0002) plane in AlN layers. Ammonia flow rate is also correlated with surface quality; pit-free and smooth AlN surfaces have been obtained at a flow rate of 70 standard cm3 per minute. Thicker AlN films improve the crystallinity of the asymmetric (101̄2) plane. ► Low ammonia (NH3) flow rate improves crystallinity of the symmetric (0002) plane in AlN layers. ► Low NH3 flow rate also leads pit-free and smooth AlN surfaces. ► Thick-layer growth improves the crystallinity of the asymmetric (101̄2) plane in AlN layers.
ISSN:1369-8001
1873-4081
DOI:10.1016/j.mssp.2011.06.003