Electrochemical Characterisation of Copper Thin-Film Formation on Polycrystalline Platinum

Electrochemically formed thin films are vital for a broad range of applications in virtually every field of modern science and technology. Understanding the film formation process could provide a means to aid the characterisation and control of film properties. Herein, we present a fundamental appro...

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Bibliographic Details
Published in:Chemphyschem 2012-09, Vol.13 (13), p.3210-3217
Main Authors: Berkes, Balázs B., Henry, John B., Huang, Minghua, Bondarenko, Alexander S.
Format: Article
Language:English
Subjects:
analytical methods
Chemistry
copper
Electrochemistry
Exact sciences and technology
General and physical chemistry
platinum
thin films
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Summary:Electrochemically formed thin films are vital for a broad range of applications in virtually every field of modern science and technology. Understanding the film formation process could provide a means to aid the characterisation and control of film properties. Herein, we present a fundamental approach that combines two well‐established analytical techniques (namely, electrochemical impedance spectroscopy and electrogravimetry) with a theoretical approach to provide physico‐chemical information on the electrode/electrolyte interface during film formation. This approach allows the monitoring of local and overall surface kinetic parameters with time to enable an evaluation of the different modes of film formation. This monitoring is independent of surface area and surface concentrations of electroactive species and so may allow current computational methods to calculate these parameters and provide a deeper physical understanding of the electrodeposition of new bulk phases. The ability of this method to characterise 3D phase growth in situ in more detail than that obtained by conventional approaches is demonstrated through the study of a model system, namely, Cu bulk‐phase deposition on a Pt electrode covered with a Cu atomic layer (Cuad/Pt). Probing complex interfaces: The complex electrochemical interface during the deposition of bulk copper on polycrystalline platinum is probed and characterised through a combination of electrochemical impedance spectroscopy and using an electrochemical quartz crystal microbalance (see picture).
ISSN:1439-4235
1439-7641
DOI:10.1002/cphc.201200193