The Prolonged Effect of Plasma Treatment upon Dielectric Properties of Wood-Based Composites

A more profitable application of wood-based composites would certainly include the possibility of their use as a dielectric material in the form of electrical insulation. The profitability and the price difference between materials normally used for these insulating purposes and those based on wood...

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Bibliographic Details
Published in:Forest products journal 2011-11, Vol.61 (8), p.694-700
Main Authors: Svrzic, Srdjan, Todorovic, Petar
Format: Article
Language:English
Subjects:
Atmospheric pressure
Bond strength
Contact angle
Dielectric properties
Effects
Electrodes
Forest products industry
Glow discharges
Moisture content
Nitrogen
Plasma etching
Plywood
Quality
Shear strength
Studies
Temperature
Wood
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Summary:A more profitable application of wood-based composites would certainly include the possibility of their use as a dielectric material in the form of electrical insulation. The profitability and the price difference between materials normally used for these insulating purposes and those based on wood would easily justify the interest to study the dielectric properties of such composites. There is another reason why an extension in use of these composites might become important. It originates from the general shortage of high-quality wood. Thus, the related properties of hardboard and medium-density fiberboard were investigated as well as plywood and particleboard. The modifications included treatments by direct current plasma glow discharge, vacuum, conditioning of samples at room temperature for prolonged periods of time, and their combinations. A relationship was discovered between the applied treatment procedures and the investigated dielectric parameters. The comparison between the treatment effects indicates those most convenient for the purpose of production of electrical insulating and also assists in differentiating which treatment processes lead to improved properties of the investigated wood-based composites.
ISSN:0015-7473
2376-9637
DOI:10.13073/0015-7473-61.8.694