Optimization of highly conductive insert architecture for cooling a rectangular chip

Conductive cooling of a rectangular chip heated from the bottom surface and connected to a heat sink is studied. Different configurations of a highly conductive material embedded in the chip are investigated and an optimal configuration for transferring heat to the heat sink is achieved. Our results...

Full description

Saved in:
Bibliographic Details
Published in:International communications in heat and mass transfer 2012-10, Vol.39 (8), p.1265-1271
Main Authors: Mazloomi, A., Sharifi, F., Salimpour, M.R., Moosavi, A.
Format: Article
Language:English
Subjects:
Applied sciences
Architecture
Channels
Chips
Configuration
Cooling
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Heat sinks
Highly conductive
Inserts
Integrated circuits
Mass transfer
Optimization
Rectangular chip
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Conductive cooling of a rectangular chip heated from the bottom surface and connected to a heat sink is studied. Different configurations of a highly conductive material embedded in the chip are investigated and an optimal configuration for transferring heat to the heat sink is achieved. Our results indicate that the optimal configuration can be obtained by using side branches, parallel with the main channel, and also increasing the thickness of the main channel. Many complex configurations are checked and it is shown that these structures do not provide better performance.
ISSN:0735-1933
1879-0178
DOI:10.1016/j.icheatmasstransfer.2012.06.010