Impurity Effect on Wear Resistance of Ultrafine-Grained Copper

The wear properties of ultrafine-grained （UFG） Cu samples of different purities were investigated in comparison with the coarse-grained （CG） Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi- static compression, exhibit an enhanced wear resistance relative to the CG Cu sampl...

Full description

Saved in:
Bibliographic Details
Published in:Journal of materials science & technology 2012-06, Vol.28 (6), p.481-487
Main Authors: Yao, Bin, Han, Zhong, Lu, Ke
Format: Article
Language:English
Subjects:
Compressing
Copper
Dynamic recrystallization
Grain size
GRAIN SIZE AND SHAPE
IMPURITIES
Impurity
Purity
Steady state
Subsurface microstructure
Ultrafine grained copper
Wear
WEAR MECHANISMS
Wear resistance
准静态压缩
动态再结晶
塑性变形
晶粒尺寸
杂质影响
耐磨损性能
超细晶
铜
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The wear properties of ultrafine-grained （UFG） Cu samples of different purities were investigated in comparison with the coarse-grained （CG） Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi- static compression, exhibit an enhanced wear resistance relative to the CG Cu samples. For both the UFG and the CG Cu samples, wear volumes increase at higher purities. A steady state worn subsurface structure was formed in each sample after sliding for 60 rain, consisting of a heavily deformed nanostructured mixing layer （NML） on top of a continuous dynamic recrystallization （DRX） layer. A pronounced correlation is identified that wear volume increases monotonically with an increasing grain size of the DRX layer. The impurity level of the Cu samples has an obvious influence on the DRX grain sizes, which in turn determines the wear resistance of the Cu samples.
ISSN:1005-0302
1941-1162
DOI:10.1016/S1005-0302(12)60086-3