Machining processes for sapphire wafers: a literature review

Sapphire wafers are widely used as the substrates for fabricating GaN light-emitting diodes (LEDs). The quality of LEDs depends directly on the quality of the sapphire wafers. A series of machining processes is required to turn sapphire barstock into wafers with the desired geometry and surface qual...

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Bibliographic Details
Published in:Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture Journal of engineering manufacture, 2011-07, Vol.225 (7), p.975-989
Main Authors: Li, Z C, Pei, Z J, Funkenbusch, P D
Format: Article
Language:English
Subjects:
Abrasive cutting
Abrasive finishing
Applied sciences
Electronics
Exact sciences and technology
Light emitting diodes
Machine tools
Machining
Mechanical engineering. Machine design
Mechanical polishing
Microelectronic fabrication (materials and surfaces technology)
Precision engineering, watch making
Sapphire
Sawing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon wafers
Slicing
Substrates
Technology
Wafers
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Summary:Sapphire wafers are widely used as the substrates for fabricating GaN light-emitting diodes (LEDs). The quality of LEDs depends directly on the quality of the sapphire wafers. A series of machining processes is required to turn sapphire barstock into wafers with the desired geometry and surface quality. This paper reviews the literature on various machining processes for sapphire wafers: slicing (including outer diameter cut-off grinding, inner diameter cut-off grinding, loose abrasive multi-wire sawing, fixed abrasive slicing, and fixed abrasive multi-wire sawing), flattening (including lapping and grinding), and surface finishing (including mechanical polishing and chemical mechanical polishing). New machining technologies are also introduced.
ISSN:0954-4054
2041-2975
DOI:10.1177/2041297510393667