A novel flip-chip interconnection process for integrated circuits

Purpose - The purpose of this paper is to present an outline of the development of a new process for the formation of flip-chip interconnections using metal coated polymer microparticles.Design methodology approach - Metal coated polymer microparticles were selectively deposited onto the bondpads of...

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Bibliographic Details
Published in:Circuit world 2012-01, Vol.38 (4), p.214-218
Main Authors: Sugden, Mark W., Hutt, David A., Whalley, David C., Liu, Changqing
Format: Article
Language:English
Subjects:
Adhesives
Atoms & subatomic particles
Bond strength
Bonding
Charged particles
Deposition
Electric fields
Electrodes
Gold
Hydrochloric acid
Integrated circuits
Interconnection
Microparticles
Nickel
Patterning
Polymers
Studies
Surface charge
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Summary:Purpose - The purpose of this paper is to present an outline of the development of a new process for the formation of flip-chip interconnections using metal coated polymer microparticles.Design methodology approach - Metal coated polymer microparticles were selectively deposited onto the bondpads of integrated circuits using electrophoresis. Thermocompression bonding was then used to bond the devices to substrates.Findings - Particles obtained a positive surface charge following immersion in an acidic solution and this surface charge allowed the particles to be deposited electrophoretically directly onto the bondpads of an integrated circuit without the need for patterning. Thermocompression bonding of nickel gold coated particles to gold coated substrates was achieved at temperatures as low as 160°C.Research limitations implications - Further work is needed to test this approach using integrated circuits with finer pitch, and to use patterned substrates for assembly and reliability measurements.Originality value - This paper presents a new method for the deposition of metal coated polymer microparticles without the need for any masking or patterning processes for the formation of interconnections on integrated circuits.
ISSN:0305-6120
1758-602X
DOI:10.1108/03056121211280422