Solid-state bonding between Al and Cu by vacuum hot pressing

Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes: hot compression under the deformation rate of 0.2 mm/min for 10 min at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 min during...

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Bibliographic Details
Published in:Transactions of Nonferrous Metals Society of China 2013-02, Vol.23 (2), p.341-346
Main Authors: LEE, Kwang Seok, KWON, Yong-Nam
Format: Article
Language:English
Subjects:
Al-Cu intermetallic compound
Aluminum
BONDING
China
composite interface
Copper
DIFFUSION BONDING
Furnaces
HARDNESS
Hot pressing
interface microstructures
INTERMETALLIC COMPOUNDS
nanoindentation
vacuum hot pressing
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Summary:Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes: hot compression under the deformation rate of 0.2 mm/min for 10 min at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 min during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as Al2Cu, AlCu+Al3Cu4 and Al4Cu9. Furthermore, local hardness values of Al2Cu, AlCu+Al3Cu4 and Al4Cu9 layers average at (4.97 ± 0.05), (6.33 ± 0.00) and (6.06 ± 0.18) GPa, respectively.
ISSN:1003-6326
DOI:10.1016/S1003-6326(13)62467-X