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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

Solder joints in electronic packaging systems are becoming smaller and smaller to meet the miniaturization requirements of electronic products and high density interconnect technology. Furthermore, many properties of the real solder joints at the microscale level are obviously different from that of...

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Published in:Journal of materials science. Materials in electronics 2013-04, Vol.24 (4), p.1369-1374
Main Authors: Yin, Limeng, Wei, Song, Xu, Zhangliang, Geng, Yanfei
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Language:English
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creator Yin, Limeng
Wei, Song
Xu, Zhangliang
Geng, Yanfei
description Solder joints in electronic packaging systems are becoming smaller and smaller to meet the miniaturization requirements of electronic products and high density interconnect technology. Furthermore, many properties of the real solder joints at the microscale level are obviously different from that of bulk solder materials. Creep, as one of the key mechanical properties at elevated temperatures, can impair the reliability of miniature solder joints in electronic devices. However, there is a lack of knowledge about the comparative creep properties of microscale solder joints of different sizes. Most previous studies have focused on the creep properties of bulk solder materials or solder joints of the same size. In this research, to determine whether a size effect exists for creep properties of solder joints or not, we characterized the creep behaviors of Sn–3.0Ag–0.5Cu lead-free solder joints under tensile loading modes using microscale butt-joint specimens with a copper-wire/solder/copper-wire sandwich structure with two different sizes. Also, the creep failure mechanisms were investigated. Experimental results show that the creep activation energy and creep stress exponent are very similar for both sizes of solder joint. However, under the same testing conditions, the joints with a larger size exhibit a much higher steady-state creep rate and a shorter creep lifetime than the smaller joints.
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1573-482X
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source Springer Nature
subjects Applied sciences
Brazing. Soldering
Characterization and Evaluation of Materials
Chemistry and Materials Science
Condensed matter: structure, mechanical and thermal properties
Creep
Creep (materials)
Creep rate
Electronics
Exact sciences and technology
High temperature
Joining, thermal cutting: metallurgical aspects
Lead free
Materials
Materials Science
Mechanical and acoustical properties of condensed matter
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Mechanical properties of solids
Metals. Metallurgy
Miniaturization
Optical and Electronic Materials
Physics
Sandwich structures
Solders
title The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures
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