NiTi/Pb(Zr0.52Ti0.48)O3 thin film heterostructures for vibration damping in MEMS

We report on the damping properties of NiTi/Pb(Zr0.52Ti0.48)O3 (PZT) heterostructures using nanoindentation technique. Creep and impact tests were performed to obtain hardness (H), elastic modulus (Er), damping factor (tanδ) and figure of merit (FOM. A hold time of 30s during creep test shows signif...

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Published in:Sensors and actuators. A. Physical. 2013-04, Vol.193, p.30-34
Main Authors: Choudhary, Nitin, Kharat, D.K., Van Humbeeck, J., Kaur, Davinder
Format: Article
Language:English
Subjects:
Damping
Intermetallics
Lead zirconate titanates
Magnetron sputtering
Nanoindentation
Nickel base alloys
Nickel compounds
Nickel titanides
Piezoelectric materials
Shape memory alloys
Shape memory materials
Thin films
Titanium compounds
Vibration damping
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cited_by cdi_FETCH-LOGICAL-c245t-b4a2b6902f887c384328311e95b717e07cd0f4898fee805f664768d480f2f7f73
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container_title Sensors and actuators. A. Physical.
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creator Choudhary, Nitin
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Kaur, Davinder
description We report on the damping properties of NiTi/Pb(Zr0.52Ti0.48)O3 (PZT) heterostructures using nanoindentation technique. Creep and impact tests were performed to obtain hardness (H), elastic modulus (Er), damping factor (tanδ) and figure of merit (FOM. A hold time of 30s during creep test shows significant improvement in damping factor for NiTi/PZT (0.046) and CrTiN/NiTi/PZT (0.050). Impact test demonstrates highest damping capacity with lowest coefficient of restitution (0.30) in CrTiN/NiTi/PZT. Higher hardness (19.8GPa) and excellent figure of merit (0.751) in CrTiN/NiTi/PZT makes them very attractive damping material for microelectromechanical systems (MEMS).
doi_str_mv 10.1016/j.sna.2012.12.005
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subjects Damping
Intermetallics
Lead zirconate titanates
Magnetron sputtering
Nanoindentation
Nickel base alloys
Nickel compounds
Nickel titanides
Piezoelectric materials
Shape memory alloys
Shape memory materials
Thin films
Titanium compounds
Vibration damping
title NiTi/Pb(Zr0.52Ti0.48)O3 thin film heterostructures for vibration damping in MEMS
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