Numerical prediction of heat transfer phenomena from a chip assembly for low Reynolds number

A three dimensional study of heat transfer from three heated blocks in a square channel at a Reynolds number of 108 with height of the chip assembly as the characteristic length is presented. Heated blocks affixed to the bottom plate represent electronic chips mounted on horizontal circuit board. A...

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Bibliographic Details
Published in:Thermal science 2011-01, Vol.15 (2), p.379-388
Main Authors: Bhatta, Srinivas, Ramarao, Seetharam, SeetharamuĻ‰, Kankanhalli
Format: Article
Language:English
Subjects:
Assembly
Channels
Chips
Circuits
Electronics
Fluid flow
Heat transfer
Numerical prediction
Reynolds number
Substrates
Thickness
Three dimensional
Upstream
Walls
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Summary:A three dimensional study of heat transfer from three heated blocks in a square channel at a Reynolds number of 108 with height of the chip assembly as the characteristic length is presented. Heated blocks affixed to the bottom plate represent electronic chips mounted on horizontal circuit board. A hexahedron block is affixed on to the top shrouding wall over the heated section. Thickness of this block is varied to study the effect on heat transfer from the chip assembly. A block of thickness equal to the passage between substrates produces maximum heat transfer enhancement. A block over the first passage enhances heat transfer from both immediate upstream and downstream chips considerably. A block over each recirculation zone produces moderate heat transfer from all the chips for a moderate pressure-drop. It is also observed that addition of blocks in the top plate does not add much to the pressure-drop in the duct. nema
ISSN:0354-9836
2334-7163
DOI:10.2298/TSCI1102379B