PCB drop test lifetime assessment based on simulations and cyclic bend tests

• Published in: Microelectronics and reliability 2013-05, Vol.53 (5), p.774-781
• Main Authors: Fuchs, P.F., Pinter, G., Major, Z.
• Format: Article
• Language: English
• Subjects: Applied sciences; Boards; Circuit boards; Computer simulation; Design. Technologies. Operation analysis. Testing; Drop tests; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Impact tests; Integrated circuits; Life cycle assessment; Mathematical models; Printed circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2013.01.001

The aim of this work was to predict the performance of printed circuit boards (PCBs) in a board level drop test (BLDT). The applied methodology was based on results of a board level cyclic bend test (BLCBT) and an according finite element simulation of the test. A function, describing the relation between a local loading parameter, determined in the simulation model for different deflection amplitudes of the BLCBT, and the according cycles to failure, measured in the experiments, was modelled. The method was evaluated by comparing the predicted results of two additional PCB built-ups with experimentally determined lifetimes. The determined lifetimes agreed very well, although the differences between the analysed PCB types were not very clear. Applying the known correlation between the BLCBT and the BLDT, the predicted results for the BLCBT could be used to estimate the BLDT performance.