Diffusion Brazing of Al6061/15 Vol. Pct Al2O3p Using a Cu-Sn Interlayer

Diffusion brazing of Al-6061 alloy containing 15 vol. pct Al 2 O 3 particles was attempted using Cu-Sn interlayer. Joint formation was attributed to the solid-state interdiffusion of Cu and Sn followed by eutectic formation and subsequent isothermal solidification. Examination of the joint region us...

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Bibliographic Details
Published in:Metallurgical and materials transactions. B, Process metallurgy and materials processing science Process metallurgy and materials processing science, 2013-06, Vol.44 (3), p.722-729
Main Authors: Cooke, Kavian O., Khan, Tahir I., Oliver, Gossett D.
Format: Article
Language:English
Subjects:
Aluminum base alloys
Applied sciences
Bonding
Brazing. Soldering
Characterization and Evaluation of Materials
Chemistry and Materials Science
Copper
Diffusion
Dispersion hardening metals
Electron probes
Exact sciences and technology
Interlayers
Intermetallic compounds
Joining, thermal cutting: metallurgical aspects
Materials Science
Metallic Materials
Metallurgy
Metals. Metallurgy
Nanotechnology
Powder metallurgy. Composite materials
Process metallurgy
Production of metals
Production techniques
Shear strength
Structural Materials
Surfaces and Interfaces
Thin Films
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Summary:Diffusion brazing of Al-6061 alloy containing 15 vol. pct Al 2 O 3 particles was attempted using Cu-Sn interlayer. Joint formation was attributed to the solid-state interdiffusion of Cu and Sn followed by eutectic formation and subsequent isothermal solidification. Examination of the joint region using scanning electron microprobe analyzer (EPMA), wavelength dispersive spectroscopy (WDS) and X-ray diffraction (XRD) showed the formation of intermetallic phases such as Al 7 Cu 3 Mg 3 , Mg 2 Cu 6 Al 5 , Cu 3 Sn, and Mg 2 Sn. The results indicated an increase in joint strength with increasing bonding time giving the highest joint shear strength of 94 MPa at a bonding duration of 3 hours.
ISSN:1073-5615
1543-1916
DOI:10.1007/s11663-013-9814-z