Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-lZn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigate...

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Bibliographic Details
Published in:International journal of minerals, metallurgy and materials metallurgy and materials, 2012-11, Vol.19 (11), p.1029-1035
Main Authors: Dong, Ming-Jie, Gao, Zhi-Ming, Liu, Yong-Chang, Wang, Xun, Yu, Li-Ming
Format: Article
Language:English
Subjects:
Copper
Indium
Intermetallic compounds
Metallurgy
Microstructure
Solderability
Solders
Tin
Tin base alloys
Wettability
微观结构
接口
无铅焊料
显微组织
机械性能
焊接
金属化合物
金属间化合物
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Summary:The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.
ISSN:1674-4799
1869-103X
DOI:10.1007/S12613-012-0665-4