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Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA
Nickel fully silicided(Ni-FUSI) gate material has been fabricated on a HfO2 surface to form a Ni-FUSI gate/HfO2/Al(MIS) structure by using an ultra-high vacuum e-beam evaporation(EBV) method followed by a one step rapid thermal annealing(RTA) treatment.X-ray diffraction(XRD) and Raman spectroscopy w...
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Published in: | Journal of semiconductors 2012-03, Vol.33 (3), p.122-124 |
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container_end_page | 124 |
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container_title | Journal of semiconductors |
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creator | Zhang, Youwei Xu, Dawei Wan, Li Wang, Zhongjian Xia, Chao Cheng, Xinhong Yu, Yuehui |
description | Nickel fully silicided(Ni-FUSI) gate material has been fabricated on a HfO2 surface to form a Ni-FUSI gate/HfO2/Al(MIS) structure by using an ultra-high vacuum e-beam evaporation(EBV) method followed by a one step rapid thermal annealing(RTA) treatment.X-ray diffraction(XRD) and Raman spectroscopy were used to reveal the microstructures and electrical properties of the MIS structure.Results show that a one step post RTA treatment is enough to promote the full reaction of nickel silicide,compared with multiple RTA treatments. Furthermore,the HfO2 gate dielectric film is sensitive to heat treatment,and multiple RTA treatments can damage the electrical properties of the HfO2 film rather than improve them.By optimization of the sample fabrication technique,the MIS capacitor produces good high-frequency capacitance-voltage curves with a hysteresis of 30 mV, a work function of about 5.44-5.53 eV and leakage current density of only 1.45×10~(-8) A/cm~2 at -1V gate bias. |
doi_str_mv | 10.1088/1674-4926/33/3/036003 |
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Furthermore,the HfO2 gate dielectric film is sensitive to heat treatment,and multiple RTA treatments can damage the electrical properties of the HfO2 film rather than improve them.By optimization of the sample fabrication technique,the MIS capacitor produces good high-frequency capacitance-voltage curves with a hysteresis of 30 mV, a work function of about 5.44-5.53 eV and leakage current density of only 1.45×10~(-8) A/cm~2 at -1V gate bias.</description><identifier>ISSN: 1674-4926</identifier><identifier>DOI: 10.1088/1674-4926/33/3/036003</identifier><language>eng</language><subject>EB病毒 ; Epstein-Barr virus ; HfO2薄膜 ; MIS结构 ; 单步 ; 快速热退火 ; 电性能 ; 超高真空电子束蒸发 ; 镍硅化物</subject><ispartof>Journal of semiconductors, 2012-03, Vol.33 (3), p.122-124</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c260t-27c4b97ff08b6f647b10f121417a4208f5dfefcfad688201265282adb0d0514d3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/94689X/94689X.jpg</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids></links><search><creatorcontrib>Zhang, Youwei</creatorcontrib><creatorcontrib>Xu, Dawei</creatorcontrib><creatorcontrib>Wan, Li</creatorcontrib><creatorcontrib>Wang, Zhongjian</creatorcontrib><creatorcontrib>Xia, Chao</creatorcontrib><creatorcontrib>Cheng, Xinhong</creatorcontrib><creatorcontrib>Yu, Yuehui</creatorcontrib><title>Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA</title><title>Journal of semiconductors</title><addtitle>Chinese Journal of Semiconductors</addtitle><description>Nickel fully silicided(Ni-FUSI) gate material has been fabricated on a HfO2 surface to form a Ni-FUSI gate/HfO2/Al(MIS) structure by using an ultra-high vacuum e-beam evaporation(EBV) method followed by a one step rapid thermal annealing(RTA) treatment.X-ray diffraction(XRD) and Raman spectroscopy were used to reveal the microstructures and electrical properties of the MIS structure.Results show that a one step post RTA treatment is enough to promote the full reaction of nickel silicide,compared with multiple RTA treatments. Furthermore,the HfO2 gate dielectric film is sensitive to heat treatment,and multiple RTA treatments can damage the electrical properties of the HfO2 film rather than improve them.By optimization of the sample fabrication technique,the MIS capacitor produces good high-frequency capacitance-voltage curves with a hysteresis of 30 mV, a work function of about 5.44-5.53 eV and leakage current density of only 1.45×10~(-8) A/cm~2 at -1V gate bias.</description><subject>EB病毒</subject><subject>Epstein-Barr virus</subject><subject>HfO2薄膜</subject><subject>MIS结构</subject><subject>单步</subject><subject>快速热退火</subject><subject>电性能</subject><subject>超高真空电子束蒸发</subject><subject>镍硅化物</subject><issn>1674-4926</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNo9kM9rwjAYhnPYYOL8EwbZbZeuX340TY9OdBNkG5vuGtIm0YJtalIP_verKJ5e-Hifj5cHoScCrwSkTInIecILKlLGUpYCEwDsDo1u9wc0ibEuAQopGQcYocV38J0NfW0j9g5r_Fkni83vEm91b7HzobEGlyfc7yyev_3hxvY7b7BuDfatTWJvO_yznj6ie6f30U6uOUabxXw9-0hWX-_L2XSVVFRAn9C84mWROweyFE7wvCTgCCWc5JpTkC4zzrrKaSOkpECoyKik2pRgICPcsDF6ufztgj8cbexVU8fK7ve6tf4YFeEMZJaRPB-q2aVaBR9jsE51oW50OCkC6qxLnbWosxbFmGLqomvgnq_czrfbQ91ubyAnw1IBBfsHGbVntw</recordid><startdate>20120301</startdate><enddate>20120301</enddate><creator>Zhang, Youwei</creator><creator>Xu, Dawei</creator><creator>Wan, Li</creator><creator>Wang, Zhongjian</creator><creator>Xia, Chao</creator><creator>Cheng, Xinhong</creator><creator>Yu, Yuehui</creator><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7U9</scope><scope>H94</scope></search><sort><creationdate>20120301</creationdate><title>Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA</title><author>Zhang, Youwei ; Xu, Dawei ; Wan, Li ; Wang, Zhongjian ; Xia, Chao ; Cheng, Xinhong ; Yu, Yuehui</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c260t-27c4b97ff08b6f647b10f121417a4208f5dfefcfad688201265282adb0d0514d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>EB病毒</topic><topic>Epstein-Barr virus</topic><topic>HfO2薄膜</topic><topic>MIS结构</topic><topic>单步</topic><topic>快速热退火</topic><topic>电性能</topic><topic>超高真空电子束蒸发</topic><topic>镍硅化物</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhang, Youwei</creatorcontrib><creatorcontrib>Xu, Dawei</creatorcontrib><creatorcontrib>Wan, Li</creatorcontrib><creatorcontrib>Wang, Zhongjian</creatorcontrib><creatorcontrib>Xia, Chao</creatorcontrib><creatorcontrib>Cheng, Xinhong</creatorcontrib><creatorcontrib>Yu, Yuehui</creatorcontrib><collection>维普_期刊</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>维普中文期刊数据库</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>CrossRef</collection><collection>Virology and AIDS Abstracts</collection><collection>AIDS and Cancer Research Abstracts</collection><jtitle>Journal of semiconductors</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhang, Youwei</au><au>Xu, Dawei</au><au>Wan, Li</au><au>Wang, Zhongjian</au><au>Xia, Chao</au><au>Cheng, Xinhong</au><au>Yu, Yuehui</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA</atitle><jtitle>Journal of semiconductors</jtitle><addtitle>Chinese Journal of Semiconductors</addtitle><date>2012-03-01</date><risdate>2012</risdate><volume>33</volume><issue>3</issue><spage>122</spage><epage>124</epage><pages>122-124</pages><issn>1674-4926</issn><abstract>Nickel fully silicided(Ni-FUSI) gate material has been fabricated on a HfO2 surface to form a Ni-FUSI gate/HfO2/Al(MIS) structure by using an ultra-high vacuum e-beam evaporation(EBV) method followed by a one step rapid thermal annealing(RTA) treatment.X-ray diffraction(XRD) and Raman spectroscopy were used to reveal the microstructures and electrical properties of the MIS structure.Results show that a one step post RTA treatment is enough to promote the full reaction of nickel silicide,compared with multiple RTA treatments. Furthermore,the HfO2 gate dielectric film is sensitive to heat treatment,and multiple RTA treatments can damage the electrical properties of the HfO2 film rather than improve them.By optimization of the sample fabrication technique,the MIS capacitor produces good high-frequency capacitance-voltage curves with a hysteresis of 30 mV, a work function of about 5.44-5.53 eV and leakage current density of only 1.45×10~(-8) A/cm~2 at -1V gate bias.</abstract><doi>10.1088/1674-4926/33/3/036003</doi><tpages>3</tpages></addata></record> |
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subjects | EB病毒 Epstein-Barr virus HfO2薄膜 MIS结构 单步 快速热退火 电性能 超高真空电子束蒸发 镍硅化物 |
title | Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA |
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