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Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy

•Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the...

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Published in:Journal of alloys and compounds 2013-07, Vol.565, p.56-65
Main Authors: Jayalakshmi, S., Sankaranarayanan, S., Koh, S.P.X., Gupta, M.
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creator Jayalakshmi, S.
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description •Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the strong basal texture of the Mg–5Sn alloy.•Both Ag and Cu reduced corrosion rate, improved thermal stability and tensile ductility. In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. When compared to pure Mg, all the alloys showed significant improvement in hardness, tensile and compressive strength values, with Ag and Cu trace additions contributing to enhanced tensile ductility. The effect of trace additions of Ag and Cu on the material behavior was identified based on structure–property correlation.
doi_str_mv 10.1016/j.jallcom.2013.02.186
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In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. 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In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. 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ispartof Journal of alloys and compounds, 2013-07, Vol.565, p.56-65
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1873-4669
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subjects Alloying additions
Alloying additive
Condensed matter: structure, mechanical and thermal properties
Copper
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Extrusion
Magnesium
Magnesium alloys
Magnesium base alloys
Materials science
Mechanical and acoustical properties
Mechanical and acoustical properties of condensed matter
Mechanical properties
Mechanical properties of solids
Microstructure
Nanoscale materials and structures: fabrication and characterization
Nanostructure
Other topics in nanoscale materials and structures
Physical properties of thin films, nonelectronic
Physics
Scanning Electron Microscopy (SEM)
Secondary phases
Silver
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thermal expansion
thermomechanical effects and density
Thermal properties of condensed matter
Thermal properties of crystalline solids
Tribology and hardness
title Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy
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