Loading…
Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy
•Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the...
Saved in:
Published in: | Journal of alloys and compounds 2013-07, Vol.565, p.56-65 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373 |
---|---|
cites | cdi_FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373 |
container_end_page | 65 |
container_issue | |
container_start_page | 56 |
container_title | Journal of alloys and compounds |
container_volume | 565 |
creator | Jayalakshmi, S. Sankaranarayanan, S. Koh, S.P.X. Gupta, M. |
description | •Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the strong basal texture of the Mg–5Sn alloy.•Both Ag and Cu reduced corrosion rate, improved thermal stability and tensile ductility.
In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. When compared to pure Mg, all the alloys showed significant improvement in hardness, tensile and compressive strength values, with Ag and Cu trace additions contributing to enhanced tensile ductility. The effect of trace additions of Ag and Cu on the material behavior was identified based on structure–property correlation. |
doi_str_mv | 10.1016/j.jallcom.2013.02.186 |
format | article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1464596281</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S092583881300529X</els_id><sourcerecordid>1464596281</sourcerecordid><originalsourceid>FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373</originalsourceid><addsrcrecordid>eNqFkE2O1DAUhC0EEk3DEZC8QWKT4J_YcVZo1JoBpEEsgLVlPT_PuJXEjZ2MNDvuwA05CQ7dYsvKi_dVlasIec1ZyxnX747t0Y0jpKkVjMuWiZYb_YTsuOll02k9PCU7NgjVGGnMc_KilCNjjA-S78jpOgSEhaZAr-6omz09rHTJDpA67-MS01xomulyj3SKkFNZ8grLmt1I8SGN60b81U0I926OUA-nnE6Yl4hl8_189_vnL_W1UuOYHl-SZ8GNBV9d3j35fnP97fCxuf3y4dPh6raBTpqlAT8oBegGLYAbAX0IwmuPg-Gyd0GLTgkljNLY-R6HrlNQKSXBMa9B9nJP3p5962d-rFgWO8UCOI5uxrQWyzvdqepe_fZEndGtXskY7CnHyeVHy5ndFrZHe1nYbgtbJmxduOreXCJcqbVDdjPE8k8selkjuKjc-zOHte9DxGwLRJwBfcx1e-tT_E_SH8pPldU</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1464596281</pqid></control><display><type>article</type><title>Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy</title><source>Elsevier</source><creator>Jayalakshmi, S. ; Sankaranarayanan, S. ; Koh, S.P.X. ; Gupta, M.</creator><creatorcontrib>Jayalakshmi, S. ; Sankaranarayanan, S. ; Koh, S.P.X. ; Gupta, M.</creatorcontrib><description>•Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the strong basal texture of the Mg–5Sn alloy.•Both Ag and Cu reduced corrosion rate, improved thermal stability and tensile ductility.
In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. When compared to pure Mg, all the alloys showed significant improvement in hardness, tensile and compressive strength values, with Ag and Cu trace additions contributing to enhanced tensile ductility. The effect of trace additions of Ag and Cu on the material behavior was identified based on structure–property correlation.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2013.02.186</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Alloying additions ; Alloying additive ; Condensed matter: structure, mechanical and thermal properties ; Copper ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Extrusion ; Magnesium ; Magnesium alloys ; Magnesium base alloys ; Materials science ; Mechanical and acoustical properties ; Mechanical and acoustical properties of condensed matter ; Mechanical properties ; Mechanical properties of solids ; Microstructure ; Nanoscale materials and structures: fabrication and characterization ; Nanostructure ; Other topics in nanoscale materials and structures ; Physical properties of thin films, nonelectronic ; Physics ; Scanning Electron Microscopy (SEM) ; Secondary phases ; Silver ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thermal expansion; thermomechanical effects and density ; Thermal properties of condensed matter ; Thermal properties of crystalline solids ; Tribology and hardness</subject><ispartof>Journal of alloys and compounds, 2013-07, Vol.565, p.56-65</ispartof><rights>2013 Elsevier B.V.</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373</citedby><cites>FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27364512$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Jayalakshmi, S.</creatorcontrib><creatorcontrib>Sankaranarayanan, S.</creatorcontrib><creatorcontrib>Koh, S.P.X.</creatorcontrib><creatorcontrib>Gupta, M.</creatorcontrib><title>Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy</title><title>Journal of alloys and compounds</title><description>•Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the strong basal texture of the Mg–5Sn alloy.•Both Ag and Cu reduced corrosion rate, improved thermal stability and tensile ductility.
In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. When compared to pure Mg, all the alloys showed significant improvement in hardness, tensile and compressive strength values, with Ag and Cu trace additions contributing to enhanced tensile ductility. The effect of trace additions of Ag and Cu on the material behavior was identified based on structure–property correlation.</description><subject>Alloying additions</subject><subject>Alloying additive</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Copper</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Extrusion</subject><subject>Magnesium</subject><subject>Magnesium alloys</subject><subject>Magnesium base alloys</subject><subject>Materials science</subject><subject>Mechanical and acoustical properties</subject><subject>Mechanical and acoustical properties of condensed matter</subject><subject>Mechanical properties</subject><subject>Mechanical properties of solids</subject><subject>Microstructure</subject><subject>Nanoscale materials and structures: fabrication and characterization</subject><subject>Nanostructure</subject><subject>Other topics in nanoscale materials and structures</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Scanning Electron Microscopy (SEM)</subject><subject>Secondary phases</subject><subject>Silver</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thermal expansion; thermomechanical effects and density</subject><subject>Thermal properties of condensed matter</subject><subject>Thermal properties of crystalline solids</subject><subject>Tribology and hardness</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkE2O1DAUhC0EEk3DEZC8QWKT4J_YcVZo1JoBpEEsgLVlPT_PuJXEjZ2MNDvuwA05CQ7dYsvKi_dVlasIec1ZyxnX747t0Y0jpKkVjMuWiZYb_YTsuOll02k9PCU7NgjVGGnMc_KilCNjjA-S78jpOgSEhaZAr-6omz09rHTJDpA67-MS01xomulyj3SKkFNZ8grLmt1I8SGN60b81U0I926OUA-nnE6Yl4hl8_189_vnL_W1UuOYHl-SZ8GNBV9d3j35fnP97fCxuf3y4dPh6raBTpqlAT8oBegGLYAbAX0IwmuPg-Gyd0GLTgkljNLY-R6HrlNQKSXBMa9B9nJP3p5962d-rFgWO8UCOI5uxrQWyzvdqepe_fZEndGtXskY7CnHyeVHy5ndFrZHe1nYbgtbJmxduOreXCJcqbVDdjPE8k8selkjuKjc-zOHte9DxGwLRJwBfcx1e-tT_E_SH8pPldU</recordid><startdate>20130715</startdate><enddate>20130715</enddate><creator>Jayalakshmi, S.</creator><creator>Sankaranarayanan, S.</creator><creator>Koh, S.P.X.</creator><creator>Gupta, M.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20130715</creationdate><title>Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy</title><author>Jayalakshmi, S. ; Sankaranarayanan, S. ; Koh, S.P.X. ; Gupta, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Alloying additions</topic><topic>Alloying additive</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Copper</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Extrusion</topic><topic>Magnesium</topic><topic>Magnesium alloys</topic><topic>Magnesium base alloys</topic><topic>Materials science</topic><topic>Mechanical and acoustical properties</topic><topic>Mechanical and acoustical properties of condensed matter</topic><topic>Mechanical properties</topic><topic>Mechanical properties of solids</topic><topic>Microstructure</topic><topic>Nanoscale materials and structures: fabrication and characterization</topic><topic>Nanostructure</topic><topic>Other topics in nanoscale materials and structures</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Scanning Electron Microscopy (SEM)</topic><topic>Secondary phases</topic><topic>Silver</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thermal expansion; thermomechanical effects and density</topic><topic>Thermal properties of condensed matter</topic><topic>Thermal properties of crystalline solids</topic><topic>Tribology and hardness</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jayalakshmi, S.</creatorcontrib><creatorcontrib>Sankaranarayanan, S.</creatorcontrib><creatorcontrib>Koh, S.P.X.</creatorcontrib><creatorcontrib>Gupta, M.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jayalakshmi, S.</au><au>Sankaranarayanan, S.</au><au>Koh, S.P.X.</au><au>Gupta, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2013-07-15</date><risdate>2013</risdate><volume>565</volume><spage>56</spage><epage>65</epage><pages>56-65</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>•Mg–5Sn alloy has been modified with trace additions of Ag (0.175%) and Cu (0.035%).•Microstructural, mechanical, thermal stability and corrosion properties are investigated.•Trace Ag and Cu modified the second-phase morphology and formed additional nanophases.•Addition of both Ag and Cu changed the strong basal texture of the Mg–5Sn alloy.•Both Ag and Cu reduced corrosion rate, improved thermal stability and tensile ductility.
In this study, the effect of trace additions of Ag (0.175 wt.%) and Cu (0.035 wt.%) on the microstructural evolution and mechanical behavior of extruded Mg–5Sn alloy is investigated. Microstructural studies revealed that all the alloys have fine grains (2–6.5μm), and that the binary Mg–5Sn alloy has polygonal and submicron-sized lath/rod-like Mg2Sn second phase particles. While Ag addition (TQ50 alloy) induced a change in morphology from lath/rod-shaped Mg2Sn to short-rod/oblong-shaped Mg–Sn–Ag particles, the presence of Ag and Cu (TQC500 alloy) resulted in an additional Mg2(Cu, Sn) nano-sized phase. From XRD analyses, it was identified that the trace addition of Ag and Cu modified the preferred Mg-crystal orientation of the Mg–5Sn alloy that had basal planes strongly aligned parallel to the extrusion direction. Both Ag and Cu contributed to a remarkable decrease in the coefficient of thermal expansion and better static salt–water corrosion resistance. When compared to pure Mg, all the alloys showed significant improvement in hardness, tensile and compressive strength values, with Ag and Cu trace additions contributing to enhanced tensile ductility. The effect of trace additions of Ag and Cu on the material behavior was identified based on structure–property correlation.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2013.02.186</doi><tpages>10</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0925-8388 |
ispartof | Journal of alloys and compounds, 2013-07, Vol.565, p.56-65 |
issn | 0925-8388 1873-4669 |
language | eng |
recordid | cdi_proquest_miscellaneous_1464596281 |
source | Elsevier |
subjects | Alloying additions Alloying additive Condensed matter: structure, mechanical and thermal properties Copper Cross-disciplinary physics: materials science rheology Exact sciences and technology Extrusion Magnesium Magnesium alloys Magnesium base alloys Materials science Mechanical and acoustical properties Mechanical and acoustical properties of condensed matter Mechanical properties Mechanical properties of solids Microstructure Nanoscale materials and structures: fabrication and characterization Nanostructure Other topics in nanoscale materials and structures Physical properties of thin films, nonelectronic Physics Scanning Electron Microscopy (SEM) Secondary phases Silver Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermal expansion thermomechanical effects and density Thermal properties of condensed matter Thermal properties of crystalline solids Tribology and hardness |
title | Effect of Ag and Cu trace additions on the microstructural evolution and mechanical properties of Mg–5Sn alloy |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T22%3A13%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effect%20of%20Ag%20and%20Cu%20trace%20additions%20on%20the%20microstructural%20evolution%20and%20mechanical%20properties%20of%20Mg%E2%80%935Sn%20alloy&rft.jtitle=Journal%20of%20alloys%20and%20compounds&rft.au=Jayalakshmi,%20S.&rft.date=2013-07-15&rft.volume=565&rft.spage=56&rft.epage=65&rft.pages=56-65&rft.issn=0925-8388&rft.eissn=1873-4669&rft_id=info:doi/10.1016/j.jallcom.2013.02.186&rft_dat=%3Cproquest_cross%3E1464596281%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c438t-cd955cea962c182c7ff2d6de98137af6245252856e4d7e9445c82c53ca0d6c373%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1464596281&rft_id=info:pmid/&rfr_iscdi=true |