Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder

• Published in: Journal of materials science. Materials in electronics 2013-12, Vol.24 (12), p.4868-4872
• Main Authors: Jing, Yanxia, Sheng, Guangmin, Huang, Zhenhua, Zhao, Guoji
• Format: Article
• Language: English
• Subjects: Alloying additive; Applied sciences; Brazing. Soldering; Characterization and Evaluation of Materials; Chemistry and Materials Science; Cross-disciplinary physics: materials science; rheology; Electronics; Exact sciences and technology; Joining, thermal cutting: metallurgical aspects; Materials; Materials Science; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Optical and Electronic Materials; Phase diagrams and microstructures developed by solidification and solid-solid phase transformations; Physics; Solidification
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-013-1490-x

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder alloy were investigated. Characteristics of Sn–9Zn–0.1Ni alloy were analyzed compared with those of as-solidified Sn–9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with as-solidified Sn–9Zn alloy, the wettability of solder was obviously improved with 0.1 wt% Ni addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of as-solidified and rapidly solidified Sn–9Zn–0.1Ni alloys was improved due to the formation of Ni–Zn intermetallic compound (IMC) and the refining of Zn-rich phases. Formation and growth of IMCs at the interface of Sn–9Zn–0.1Ni/Cu joints was significantly depressed. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.