Laser printing of conformal and multi-level 3D interconnects

• Published in: Applied physics. A, Materials science & processing Materials science & processing, 2013-10, Vol.113 (1), p.5-8
• Main Authors: Kim, H., Duocastella, M., Charipar, K. M., Auyeung, R. C. Y., Piqué, A.
• Format: Article
• Language: English
• Subjects: Characterization and Evaluation of Materials; Condensed Matter Physics; Cross-disciplinary physics: materials science; rheology; Electrodeposition, electroplating; Electrodes; Exact sciences and technology; Machines; Manufacturing; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Nanotechnology; Optical and Electronic Materials; Physics; Physics and Astronomy; Processes; Rapid Communication; Surfaces and Interfaces; Thin Films
• ISSN: 0947-8396; 1432-0630
• DOI: 10.1007/s00339-013-7909-7

A crucial challenge in three-dimensional multi-chip assemblies is to establish electrical connections between discrete devices. Here, we apply laser printing of congruent voxels of silver nanopaste for the fabrication of conformal and 3D multi-level interconnects. By controlling laser fluence, various 3D electrodes including freestanding tabs and side contacts over vertical walls can be directly printed without the need for sacrificial layers, chemical etching or electroplating. The electrical characteristics of the printed interconnects are similar to those currently in use by the semiconductor industry. These results are a promising step forward in the generation of customized interconnects for 3D microelectronics.