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All in-situ GaSb MOS structures on GaAs (001): Growth, passivation and high-k oxides
The GaSb-on-GaAs growth was optimized for the fabrication of metal-oxide-semiconductor (MOS) capacitors (Caps) with low interface state trap density (Dit) using in-situ deposited amorphous silicon (a-Si) interface passivation layer (IPL) and high-k oxides. The best top surface with the average rough...
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Published in: | Journal of crystal growth 2013-09, Vol.378, p.631-635 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The GaSb-on-GaAs growth was optimized for the fabrication of metal-oxide-semiconductor (MOS) capacitors (Caps) with low interface state trap density (Dit) using in-situ deposited amorphous silicon (a-Si) interface passivation layer (IPL) and high-k oxides. The best top surface with the average roughness Ra=0.37nm and with spiral type “step-flow” growth mode was observed in the GaSb structure with the initial 0.5μm grown at 410°C and the top 0.5μm grown at 485°C. N- and p-type GaSb MOSCaps with reasonable capacitance–voltage(C–V) characteristics at room temperature (RT) were demonstrated using all in-situ 0.5nm a-Si IPL and 10nm Al2O3+HfO2 or Al2O3. A-Si IPL was found essential for n-MOSCaps but not in the case of p-MOSCaps where comparable C–V characteristics with a similarly low Dit=1–2×1012cm−2eV−1were demonstrated without IPL.
► The GaSb-on-GaAs growth was optimized for the fabrication of MOSCaps with low Dit. ► The top surface with “step-flow” growth mode and Ra=0.37nm was obtained. ► All in-situ deposited a-Si IPL and high-k oxides were used in MOSCaps. ► N-/p-type GaSb MOSCaps with reasonable C–V characteristics at RT were demonstrated. ► A-Si IPL was found essential for n-MOSCaps but not in the case of p-MOSCaps. |
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ISSN: | 0022-0248 1873-5002 |
DOI: | 10.1016/j.jcrysgro.2012.12.105 |