Heat conduction across metal and nonmetal interface containing imbedded graphene layers

Thermal conductance at the interface between metal and non-metal materials in the presence or absence of an inserted graphene layer is measured using a time domain transient thermoreflectance technique. The insertion of a single layer graphene between thermal evaporation Al film and Si substrate enh...

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Bibliographic Details
Published in:Carbon (New York) 2013-11, Vol.64, p.61-66
Main Authors: Zhang, Chunwei, Zhao, Weiwei, Bi, Kedong, Ma, Jian, Wang, Jianli, Ni, Zhenhua, Ni, Zhonghua, Chen, Yunfei
Format: Article
Language:English
Subjects:
Aluminum
Chemistry
Diffusion
Exact sciences and technology
General and physical chemistry
Graphene
Heat transfer
Insertion
Magnetron sputtering
Silicon substrates
Surface physical chemistry
Thermal conductivity
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Summary:Thermal conductance at the interface between metal and non-metal materials in the presence or absence of an inserted graphene layer is measured using a time domain transient thermoreflectance technique. The insertion of a single layer graphene between thermal evaporation Al film and Si substrate enhances the interfacial thermal conductance, because the graphene works as a mask to prevent the metal atoms diffusing into the substrate and causes the reduction of the intermixing layer thickness. Conversely, for the Al/Si interface with the Al film prepared by magnetron sputtering, the insertion of a single layer graphene increases the number of interface and leads to the decrease of the interfacial thermal conductance.
ISSN:0008-6223
1873-3891
DOI:10.1016/j.carbon.2013.07.021