Electro-mechanical studies of micro-tube insertion into AlaCu pads for 10 mu m pitch interconnection technology and 3D applications

Various interconnection technologies such as reflow soldering, thermo-compression, Direct Bond Interconnect (DBI), Solid Liquid Inter Diffusion (SLID) and insertion are under intense investigation in order to accommodate the latest revision of the International Technology Roadmap for Semiconductors...

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Bibliographic Details
Published in:Microelectronic engineering 2013-07, Vol.107, p.84-90
Main Authors: BrugiA"re, B, Marion, F, Fendler, M, Mandrillon, V, Hazotte, A, Volpert, M, Ribot, H
Format: Article
Language:English
Subjects:
Bonding
Diffusion welding
Insertion
Interconnection
Liquids
Reflow soldering
Semiconductors
Three dimensional
Online Access:Get full text
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Summary:Various interconnection technologies such as reflow soldering, thermo-compression, Direct Bond Interconnect (DBI), Solid Liquid Inter Diffusion (SLID) and insertion are under intense investigation in order to accommodate the latest revision of the International Technology Roadmap for Semiconductors (ITRS). The room-temperature insertion technology has been proposed and developed using micro-tubes as inserts to address most of the industrial bonding issues.
ISSN:0167-9317
DOI:10.1016/j.mee.2012.10.021