On-chip temperature compensation for optical transmitter modules

On-chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)-substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabri...

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Bibliographic Details
Published in:Electronics letters 2013-01, Vol.49 (3), p.1-1
Main Authors: Sangirov, J, Park, T-W, Ukaegbu, I A, Lee, T-W, Park, H-H
Format: Article
Language:English
Subjects:
Blocking
Modules
Monitoring
Photodiodes
Power consumption
Silicon
Temperature compensation
Transmitters
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Summary:On-chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)-substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 µm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10- 12 is achieved at a received input power of - 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20-100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block. [PUBLICATION ABSTRACT]
ISSN:0013-5194
1350-911X