Enhanced polymer filling and uniform shrinkage of polymer and mold in a hot embossing process

Low filling efficiency and large thermal stress are two important problems that limit the wide use of hot embossing especially in fabricating high aspect ratio patterns. Two types of flow barriers, the first being an accessorial slot on the mold (SFB), the other was a block on the hot embossing mach...

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Bibliographic Details
Published in:Polymer engineering and science 2013-06, Vol.53 (6), p.1314-1320
Main Authors: He, Yong, Fu, JianZhong, Zhao, Peng, Chen, Zi Chen
Format: Article
Language:English
Subjects:
Applied sciences
Barriers
Blocking
Circuit properties
Computer simulation
Deformation
Electric, optical and optoelectronic circuits
Electronics
Embossing
Exact sciences and technology
Finite element method
Integrated optics. Optical fibers and wave guides
Machinery and processing
Mathematical analysis
Mechanical properties
Miscellaneous
Molding
Molds
Optical and optoelectronic circuits
Plastics
Polymer industry, paints, wood
Polymeric composites
Polymers
Production processes
Shrinkage
Simulation
Technology of polymers
Temperature effects
Thermal stresses
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Summary:Low filling efficiency and large thermal stress are two important problems that limit the wide use of hot embossing especially in fabricating high aspect ratio patterns. Two types of flow barriers, the first being an accessorial slot on the mold (SFB), the other was a block on the hot embossing machine (BFB), were designed to enhance polymer filling and their performances were simulated with the finite element method. The numerical simulation results show that two kinds of flow barriers can also accelerate the polymer filling speed and improve filling efficiency. The BFB has a better promoting effect and can be easily used as a quasi close‐die embossing process. The shrinkage of the polymer and mold is made uniform with a designed polymer grip holder to minimize the thermal stress. The polymer was clipped at a temperature in a cooling step and its deformation was fixed; thus, the shrinkage of the polymer can be equal to the mold at a special temperature. An improved hot embossing machine was designed and the hot embossing process was modified to satisfy these requirements. At last successful fabrication of the light guide plate verified the improvements. POLYM. ENG. SCI., 2013. © 2012 Society of Plastics Engineers
ISSN:0032-3888
1548-2634
DOI:10.1002/pen.23379